UMX509 - Microchip

UMX509 MELF PIN Diodes

Surface Mount—MELF PIN Diodes UMX502—UMX812 Product Overview This line of metal electrode leadless face (MELF) high–power PIN diodes consists of hermetically sealed surface mount packaged devices with full–face bonded chips for low–inductance construction. The MELF ceramic package has square–end terminations, which are ideal for surface mount and pick–and–.

Features

• Low
  –magnetic (ideal for MRI applications)
• Very low inductance, full
  –face bonding
• High
  –reliability hermetic design
• Surface mount devices available in tape and reel
• RoHS compliant1
• ESD HMB Class 2 Package Styles Applications
• Designed for low
  –loss and low
  –distortion applications
• Switch
  –filter bank
• T/R control
• Attenuators
• MRI switching Performance Overview Parameter Conditions Value Units VB IR = 10 μA 500 V CT at 50V 0.5
  –1.2 pF Rs at 100 mA 0.40
  –0.85 Ω Rs at 200 mA 0.2
  –0.55 Ω TL 1.5
  –5.5 μs θP 15
  –35 °C/W Note:  1. RoHS versions are supplied with a matte tin .