TECH MOS Technology. N-Channel High Density Trench MOSFET TM2314FN PRODUCT SUMMARY VDSS ID 5.4 20V 4.3 46 @ VGS = 2.5V RDS(on) (m-ohm) Max 30 @ VGS = 4.5V FEATURES ●Super high dense cell trench design for low RDS(on). ●Rugged and reliable. ●Surface Mount package. D SOT-23-3L D S G S G ABSOLUTE MAXIMUM RATINGS (TA = 25 °C unless otherwise noted) Paramet.
●Super high dense cell trench design for low RDS(on).
●Rugged and reliable.
●Surface Mount package.
D
SOT-23-3L
D S G S G
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C unless otherwise noted)
Parameter
Drain-Source Voltage Gate-Source Voltage Drain Current-Continuous @ TA = 25 °C -Pulse b Drain-Source Diode Forward Current Maximum Power Dissipation
a a a
Symbol
VDS VGS ID IDM IS PD TJ,TSTG
Limit
20 ± 12 5.4 21.5 1.7 1.25 0.75 - 55 to 150
Unit
V V A A A W °C
TA=25°C TA=75°C
Operating Junction and Storage Temperature Range
THERMAL CHARACTERISTICS
Thermal Resistance,Junction-to-Ambient
Note a. Su.
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | TM2314 |
Titan Micro |
Digital audio processing circuit control | |
2 | TM2312 |
Taimao |
N-Channel 20-V(D-S) MOSFET | |
3 | TM2313 |
TITAN MICRO ELECTRONICS |
Digital audio processing controller | |
4 | TM235VFS01-00 |
AVIC |
TFT LCD | |
5 | TM2001 |
Taiwan Microelectronics |
2.4-2.5GHz Front End Module | |
6 | TM200CZ-24 |
Mitsubishi Electric Semiconductor |
HIGH POWER GENERAL USE INSULATED TYPE | |
7 | TM200CZ-2H |
Mitsubishi Electric Semiconductor |
HIGH POWER GENERAL USE INSULATED TYPE | |
8 | TM200CZ-H |
Mitsubishi Electric Semiconductor |
HIGH POWER GENERAL USE INSULATED TYPE | |
9 | TM200CZ-M |
Mitsubishi Electric Semiconductor |
HIGH POWER GENERAL USE INSULATED TYPE | |
10 | TM200DZ-24 |
Mitsubishi Electric Semiconductor |
HIGH POWER GENERAL USE INSULATED TYPE | |
11 | TM200DZ-2H |
Mitsubishi Electric Semiconductor |
HIGH POWER GENERAL USE INSULATED TYPE | |
12 | TM200DZ-H |
Mitsubishi Electric Semiconductor |
HIGH POWER GENERAL USE INSULATED TYPE |