. 12 State Machine Description . . . 13 General Product Characteristics .
ons and Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 State Machine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 State Machine Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 General Product Characterist.
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | TLE8264-2E |
Infineon Technologies |
Universal System Basis Chip | |
2 | TLE8261-2E |
Infineon Technologies |
Universal System Basis Chip | |
3 | TLE8261E |
Infineon Technologies |
Universal System Basis Chip | |
4 | TLE8262-2E |
Infineon Technologies |
Universal System Basis Chip | |
5 | TLE8262E |
Infineon Technologies |
Universal System Basis Chip | |
6 | TLE8263-2E |
Infineon Technologies |
Universal System Basis Chip | |
7 | TLE8263E |
Infineon Technologies |
Universal System Basis Chip | |
8 | TLE8201R |
Infineon Technologies |
Door Module Power | |
9 | TLE8203E |
Infineon Technologies |
Mirror Power | |
10 | TLE8209-2 |
Infineon Technologies |
SPI Programmable H-Bridge | |
11 | TLE8209-2SA |
Infineon Technologies |
SPI Programmable H-Bridge | |
12 | TLE8209-4SA |
Infineon Technologies |
SPI Programmable H-Bridge |