These miniature surface mount MOSFETs utilize a high cell density trench process to provide low RDS(on) and to ensure minimal power loss and heat dissipation. Typical applications are DC-DC converters and power management In portable and battery-powered products such as computers, printers, PCMCIA cards, cellular and cordless telephones. DFN3*3-8PP FEATURE.
Low RDS(on) provides higher efficiency and extends battery life. Low thermal impedance copper leadframe SOP-8 saves board space. Fast switching speed. High performance trench technology.
PACKAGE INFORMATION
Package DFN3
*3-8PP MPQ 3K Leader Size 13’ inch
REF. A B C D E F
Millimeter Min. Max. 3.0 BSC. 3.2 BSC. 0.2 0.35 0.65 BSC. 0.1 0.25 3.0 BSC
REF. G H I J K L
Millimeter Min. Max. 0.7 0.9 1.1 BSC. 2.475 BSC 1.8 BSC. 0.3 0.5 0.52 BSC
S G S G
D D D D
MAXIMUM RATINGS (TA = 25°C unless otherwise specified)
Parameter
Drain-Source Voltage Gate-Source Voltage Continuous Drain Current Pulsed D.
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | SSPS7308NA |
SeCoS Halbleitertechnologie |
N-Channel MOSFET | |
2 | SSPS7331P-C |
SeCoS |
P-Channel MOSFET | |
3 | SSPS7332N-C |
SeCoS |
N-Ch Enhancement Mode Power MOSFET | |
4 | SSPS7338N |
SeCoS |
N-Channel MOSFET | |
5 | SSPS920NE |
SeCoS Halbleitertechnologie |
N-Channel MOSFET | |
6 | SSPS924NE |
SeCoS Halbleitertechnologie |
N-Ch Enhancement Mode Power MOSFET | |
7 | SSP-T |
ETC |
Surface Mount Quartz Crystal | |
8 | SSP-T5 |
ETC |
Surface Mount Quartz Crystal | |
9 | SSP-T7-F |
Seiko |
SMD Quartz Crystal | |
10 | SSP-T7-FL |
Seiko |
SMD Quartz Crystal | |
11 | SSP0430A-800480 |
Surenoo |
SPI TFT LCD Module | |
12 | SSP100 |
HALCRO |
(SSP80 / SSP100) Surround Sound Processor Manual |