It utilizes the latest processing techniques to achieve the high cell density and reduces the on-resistance with high repetitive avalanche rating. These features combine to make this design an extremely efficient and reliable devicefor use in power switching application and a wide variety of other applications. Absolute Max Rating: Symbol ID @ TA = 25°C I.
Advanced MOSFET process technology Special designed for PWM, load switching and general purpose applications Ultra low on-resistance with low gate charge Fast switching and reverse body recovery 150℃ operating temperature SSF3115H1 Pin Assignments Schematic Diagram Description: It utilizes the latest processing techniques to achieve the high cell density and reduces the on-resistance with high repetitive avalanche rating. These features combine to make this design an extremely efficient and reliable devicefor use in power switching application and a wide variety of other applications. Ab.
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | SSF3115J7 |
Silikron |
MOSFET | |
2 | SSF3115J8 |
Silikron |
MOSFET | |
3 | SSF3117 |
Silikron Semiconductor Co |
Schottky Diode | |
4 | SSF3108DU |
Silikron |
MOSFET | |
5 | SSF3108H1 |
Silikron |
MOSFET | |
6 | SSF3108H1U |
Silikron |
MOSFET | |
7 | SSF3108H1X |
Silikron |
MOSFET | |
8 | SSF3108J2 |
Silikron |
MOSFET | |
9 | SSF3108J7U |
Silikron |
MOSFET | |
10 | SSF3108J8 |
Silikron |
MOSFET | |
11 | SSF3134KW-C |
SeCoS |
N-Ch Enhancement Mode Power MOSFET | |
12 | SSF3139KW |
SeCoS |
P-Channel MOSFET |