It utilizes the latest trench processing techniques to achieve the high cell density and reduces the on-resistance with high repetitive avalanche rating. These features combine to make this design an extremely efficient and reliable device for use in battery charge and load switching in cellular handset and a wide variety of other ultraportable applications.
Advanced trench MOSFET process technology
Special designed for battery charge, load
switching in cellular handset and general ultraportable applications
Ultra low on-resistance with low gate charge
Fast switching and reverse body recovery
150℃ operating temperature
SSF3108J2
Schematic Diagram
Description:
It utilizes the latest trench processing techniques to achieve the high cell density and reduces the on-resistance with high repetitive avalanche rating. These features combine to make this design an extremely efficient and reliable device for use in battery charge and load switc.
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | SSF3108J7U |
Silikron |
MOSFET | |
2 | SSF3108J8 |
Silikron |
MOSFET | |
3 | SSF3108DU |
Silikron |
MOSFET | |
4 | SSF3108H1 |
Silikron |
MOSFET | |
5 | SSF3108H1U |
Silikron |
MOSFET | |
6 | SSF3108H1X |
Silikron |
MOSFET | |
7 | SSF3115H1 |
Silikron |
MOSFET | |
8 | SSF3115J7 |
Silikron |
MOSFET | |
9 | SSF3115J8 |
Silikron |
MOSFET | |
10 | SSF3117 |
Silikron Semiconductor Co |
Schottky Diode | |
11 | SSF3134KW-C |
SeCoS |
N-Ch Enhancement Mode Power MOSFET | |
12 | SSF3139KW |
SeCoS |
P-Channel MOSFET |