This device is produced with advanced high carrier density technology, which is especially used to minimize saturation voltage drop. This device particularly suits low voltage applications such as portable equipment, power management and other battery powered circuits, and low in-line power dissipation are needed in a very small outline surface mount package.
PNP BJT VCE -40v
VBE -6v
Vcesat typ -150mv
Ic -3A
Applications
battery powered circuits
low in-line power dissipation circuits
Pin configuration
General Description This device is produced with advanced high carrier
density technology, which is especially used to minimize saturation voltage drop. This device particularly suits low voltage applications such as portable equipment, power management and other battery powered circuits, and low in-line power dissipation are needed in a very small outline surface mount package. Excellent thermal and electrical capabilities.
Package.
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | SSCP005GS3 |
AFSEMI |
High Frequency High Gain PNP Power BJT | |
2 | SSCP005GSB |
AFSEMI |
High Frequency High Gain PNP Power BJT | |
3 | SSCP111 |
Intellon Corporation |
PL Media Interface Ic / Cebus Compliant | |
4 | SSCP485 |
ETC |
SSC P485 PL Transceiver IC | |
5 | SSC-AM101 |
Seoul Semiconductor |
CHIP LED DEVICE | |
6 | SSC-AWT722 |
Seoul Semiconductor |
TOP LED DEVICE | |
7 | SSC-CMX2 |
Firesense |
Clip Addressable Output Module | |
8 | SSC-D3232SL-88 |
Seoul Semiconductor |
LED DOT MATRIX | |
9 | SSC-ERT801 |
Seoul Semiconductor |
TOP LED DEVICE | |
10 | SSC-FAT801 |
Seoul Semiconductor |
TOP LED DEVICE | |
11 | SSC-FB102 |
Seoul Semiconductor |
LED DEVICE | |
12 | SSC-HB601 |
Seoul Semiconductor |
LED DEVICE |