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*Customer: SPECIFICATION ITEM MODEL Revision Date www.DataSheet4U.com CHIP LED DEVICE SSC-FB102 [Contents] 1. Features 2. Absolute maximum ratings 3. Electro-optical characteristics 4. Characteristic diagram 5. Soldering profile 6. Outline dimension 7. Packing 8. Reel packing structure 9. Precaution for use Drawn by Checked by Approved by SSC-QP-0401-.
2. Absolute maximum ratings 3. Electro-optical characteristics 4. Characteristic diagram 5. Soldering profile 6. Outline dimension 7. Packing 8. Reel packing structure 9. Precaution for use
Drawn by
Checked by
Approved by
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537
SSC-FB102 Seoul Semiconductor
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1. Features
Package : 1.6×0.8×0.6 mm Untinted, Diffused flat mold Wavelength : 590 nm
2. Absolute Maximum Ratings Parameter Power Dissipation Forward Current Symbol Pd IF IFM
*1 VR Topr Tstg Value.
| No. | Partie # | Fabricant | Description | Fiche Technique |
|---|---|---|---|---|
| 1 | SSC-FAT801 |
Seoul Semiconductor |
TOP LED DEVICE |
|
| 2 | SSC-AM101 |
Seoul Semiconductor |
CHIP LED DEVICE |
|
| 3 | SSC-AWT722 |
Seoul Semiconductor |
TOP LED DEVICE |
|
| 4 | SSC-CMX2 |
Firesense |
Clip Addressable Output Module |
|
| 5 | SSC-D3232SL-88 |
Seoul Semiconductor |
LED DOT MATRIX |
|
| 6 | SSC-ERT801 |
Seoul Semiconductor |
TOP LED DEVICE |
|
| 7 | SSC-HB601 |
Seoul Semiconductor |
LED DEVICE |
|
| 8 | SSC-MBT722 |
Seoul Semiconductor |
TOP LED DEVICE |
|
| 9 | SSC-MBT801 |
Seoul Semiconductor |
LED |
|
| 10 | SSC-MGT801 |
Seoul Semiconductor |
LED |
|
| 11 | SSC-MPW104-F1 |
Seoul Semiconductor |
CHIP LED DEVICE |
|
| 12 | SSC-SFT825N-S |
Seoul Semiconductor |
Top View LED |
|