( DataSheet : www.DataSheet4U.com ) PDF: 2004 Feb 05 Philips Semiconductors Package outline HTQFP48: plastic thermal enhanced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad SOT545-3 c y exposed die pad side X Dh 36 37 25 24 ZE A e Eh w M θ bp pin 1 index 48 1 w M 12 ZD v M A 13 detail X Lp L E HE A A2 A1 (A 3) bp e D HD B v M .
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No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | SOT527-1 |
NXP |
Package outline | |
2 | SOT-143 |
Alpha Industries |
Surface Mount Schottky Quad Mixer Diodes | |
3 | SOT-23 |
Motorola |
Zener Voltage Regulator Didoes | |
4 | SOT-23-1 |
Alpha Industries |
Low Resistance Low Capacitance Plastic Packaged PIN Diodes | |
5 | SOT-23CD |
Crownpo |
Small Signal Switching Diode | |
6 | SOT-343 |
Central Semiconductor |
Package Details | |
7 | SOT-343 |
Vishay Siliconix |
Package Dimensions | |
8 | SOT-353 |
SYNC POWER |
SOT-353 | |
9 | SOT-363L |
Vishay Siliconix |
Package Dimensions in mm | |
10 | SOT-89 |
Excelics |
PCB Mounting Considerations | |
11 | SOT-89 |
Jiangsu |
Transistor | |
12 | SOT-89-3L |
ETC |
PACKAGE OUTLINE DIMENSIONS |