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SOT545-3 - NXP

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SOT545-3 plastic thermal enganced thin quad flat package

( DataSheet : www.DataSheet4U.com ) PDF: 2004 Feb 05 Philips Semiconductors Package outline HTQFP48: plastic thermal enhanced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad SOT545-3 c y exposed die pad side X Dh 36 37 25 24 ZE A e Eh w M θ bp pin 1 index 48 1 w M 12 ZD v M A 13 detail X Lp L E HE A A2 A1 (A 3) bp e D HD B v M .

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