Recherchez avec le numéro de pièce ainsi que le fabricant ou la description
PDF: 2003 Apr 07 Philips Semiconductors Package outline HTSSOP20: plastic thermal enhanced thin shrink small outline package; 20 leads; body width 4.4 mm; exposed die pad SOT527-1 D E A X c y exposed die pad side HE v M A Z Dh 20 11 pin 1 index Eh A2 A1 (A 3) A θ Lp L 1 e bp 10 w M detail X 0 2.5 scale 5 mm DIMENSIONS (mm are the ori.
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| No. | Partie # | Fabricant | Description | Fiche Technique |
|---|---|---|---|---|
| 1 | SOT545-3 |
NXP |
plastic thermal enganced thin quad flat package |
|
| 2 | SOT-143 |
Alpha Industries |
Surface Mount Schottky Quad Mixer Diodes |
|
| 3 | SOT-23 |
Motorola |
Zener Voltage Regulator Didoes |
|
| 4 | SOT-23-1 |
Alpha Industries |
Low Resistance Low Capacitance Plastic Packaged PIN Diodes |
|
| 5 | SOT-23CD |
Crownpo |
Small Signal Switching Diode |
|
| 6 | SOT-343 |
Central Semiconductor |
Package Details |
|
| 7 | SOT-343 |
Vishay Siliconix |
Package Dimensions |
|
| 8 | SOT-353 |
SYNC POWER |
SOT-353 |
|
| 9 | SOT-363L |
Vishay Siliconix |
Package Dimensions in mm |
|
| 10 | SOT-89 |
Excelics |
PCB Mounting Considerations |
|
| 11 | SOT-89 |
Jiangsu |
Transistor |
|
| 12 | SOT-89-3L |
ETC |
PACKAGE OUTLINE DIMENSIONS |
|