SIDC46D170H - Infineon

SIDC46D170H Fast switching diode

AQL 0,65 for visual inspection according to failure catalog Electrostatic Discharge Sensitive Device according to MIL-STD 883 Test-Normen Villach/Prüffeld Published by Infineon Technologies AG Bereich Kommunikation St.-Martin-Strasse 53 D-81541 München © Infineon Technologies AG 2000 All Rights Reserved. Attention please! The information herein is given to.

Features

A
• 1700V EMCON 3 technology 200 µm chip This chip is used for:
• soft, fast switching
• EUPEC power modules
• low reverse recovery charge
• small temperature coefficient Applications: C
• resonant applications, drives Chip Type SIDC46D170H VR IF Die Size 1700V 75A 6.8 x 6.8 mm2 Package Ordering Code sawn on foil Q67050-A4175A001 MECHANICAL PARAMETER: Raster size Area total / active Anode pad size Thickness Wafer size Flat position Max. possible chips per wafer Passivation frontside Anode metallization Cathode metallization Die bond Wire bond Reject Ink Dot Size Recommended.