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SC7777D - KOA Speer Electronics

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SC7777D hybrid IC

KA, SC www.DataSheet4U.com hybrid IC EU NEW features • Adjustment processes are decreased by function and ratio trimmings • High density mounting by bonding (COB) • Various types of package are available • High reliability achieved by KOA’s original thick film technology • Thick film printed circuit substrate applies the non-noble metal paste (conductive p.

Features


• Adjustment processes are decreased by function and ratio trimmings
• High density mounting by bonding (COB)
• Various types of package are available
• High reliability achieved by KOA’s original thick film technology
• Thick film printed circuit substrate applies the non-noble metal paste (conductive paste and resistive paste) and receives the many total inquires including material selecting, pattern designing and mass production EW ordering information N New Part # KA Product Code KA: Hybrid IC SC: Non-Noble 7777 KOA Ref. Number D Terminal Surface Material D: SnAgCu T: Sn Component - KA/C.

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