The MDP/F12N50B uses advanced Magnachip’s MOSFET Technology, which provides low on-state resistance, high switching performance and excellent quality. MDP/F12N50B is suitable device for SMPS, high Speed switching and general purpose applications. Features VDS = 500V ID = 11.5A RDS(ON) ≤ 0.65Ω @VGS = 10V @VGS = 10V Applications Power Supply PFC Ballast Ab.
VDS = 500V ID = 11.5A RDS(ON) ≤ 0.65Ω
@VGS = 10V @VGS = 10V
Applications
Power Supply PFC Ballast
Absolute Maximum Ratings (Ta = 25oC)
Drain-Source Voltage Gate-Source Voltage
Characteristics
Continuous Drain Current Pulsed Drain Current(1)
Power Dissipation
Repetitive Avalanche Energy(1) Peak Diode Recovery dv/dt(3) Single Pulse Avalanche Energy(4) Junction and Storage Temperature Range ※ Id limited by maximum junction temperature
TC=25oC TC=100oC
TC=25oC Derate above 25 oC
Symbol VDSS VGSS
ID
IDM
PD
EAR dv/dt EAS TJ, Tstg
MDP12N50B MDF12N50B 500 ±30
11.5 11.5
* 7.0 7.0
* 46 46
* 165 4.
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | MDF12N50 |
MagnaChip |
N-Channel MOSFET 500V | |
2 | MDF12N50F |
MagnaChip |
N-Channel MOSFET | |
3 | MDF12N50TH |
MagnaChip |
N-Channel MOSFET 500V | |
4 | MDF12-1416P |
Hirose Electric |
Crimping Contact Directly Mounted on Board | |
5 | MDF12-1416PC |
Hirose Electric |
Crimping Contact Directly Mounted on Board | |
6 | MDF12-1416PCF |
Hirose Electric |
Crimping Contact Directly Mounted on Board | |
7 | MDF12-1822P |
Hirose Electric |
Crimping Contact Directly Mounted on Board | |
8 | MDF12-1822PC |
Hirose Electric |
Crimping Contact Directly Mounted on Board | |
9 | MDF12-1822PCF |
Hirose Electric |
Crimping Contact Directly Mounted on Board | |
10 | MDF12-TA1416HC |
Hirose Electric |
Crimping Contact Directly Mounted on Board | |
11 | MDF12-TA1822HC |
Hirose Electric |
Crimping Contact Directly Mounted on Board | |
12 | MDF12A-1416P |
Hirose Electric |
Crimping Contact Directly Mounted on Board |