The Samsung KMM5362203C2W is a 2Mx36bits Dynamic RAM high density memory module. The Samsung KMM5362203C2W consists of four CMOS 1Mx16bits DRAMs in 42-pin SOJ package mounted and two CMOS 1Mx4bit Quad CAS DRAM in 24-pin SOJ package on a 72-pin glassepoxy substrate. A 0.1 or 0.22uF decoupling capacitor is mounted on the printed circuit board for each DRAM. Th.
• Part Identification - KMM5362203C2W(1024 cycles/16ms Ref, SOJ, Solder) - KMM5362203C2WG(1024 cycles/16ms Ref, SOJ, Gold)
• Fast Page Mode Operation
• CAS-before-RAS refresh capability
• RAS-only and Hidden refresh capability
• TTL compatible inputs and outputs
• Single +5V ±10% power supply
• JEDEC standard PDPin & pinout
• PCB : Height(750mil), double sided component
PERFORMANCE RANGE
Speed -5 -6
tRAC
50ns 60ns
tCAC
15ns 15ns
tRC
90ns 110ns
PIN CONFIGURATIONS
Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 Symbol VSS DQ0 DQ18 DQ1 D.
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | KMM5362205C2W |
Samsung Semiconductor |
DRAM MODULE | |
2 | KMM5362000A1 |
Samsung Electronics |
2M x 36 DRAM SIMM Memory Module | |
3 | KMM5362000A1G |
Samsung Electronics |
2M x 36 DRAM SIMM Memory Module | |
4 | KMM5362000B |
Samsung Electronics |
2M x 36 DRAM SIMM Memory Module | |
5 | KMM5362000B2 |
Samsung Electronics |
2M x 36 DRAM SIMM Memory Module | |
6 | KMM5362000B2G |
Samsung Electronics |
2M x 36 DRAM SIMM Memory Module | |
7 | KMM5362000BG |
Samsung Electronics |
2M x 36 DRAM SIMM Memory Module | |
8 | KMM5362000BH |
Samsung Electronics |
2M x 36 DRAM SIMM Memory Module | |
9 | KMM5362003 |
Samsung Electronics |
2M x 36 DRAM SIMM Memory Module | |
10 | KMM5362003G |
Samsung Electronics |
2M x 36 DRAM SIMM Memory Module | |
11 | KMM5361203C2W |
Samsung Semiconductor |
1MBx36 DRAM Simm Using 1MBx16 And 1MBx4 Quad Cas | |
12 | KMM5361205C2W |
Samsung Semiconductor |
1MBx36 DRAM Simm Using 1MBx16 And 4MB Quad Cas Edo |