DDR SDRAM 16Mb x 16 32Mb x 8 VDD DQ0 VDDQ DQ1 DQ2 VSSQ DQ3 DQ4 VDDQ DQ5 DQ6 VSSQ DQ7 NC VDDQ LDQS NC VDD NC LDM WE CAS RAS CS NC BA0 BA1 AP/A10 A0 A1 A2 A3 VDD VDD DQ0 VDDQ NC DQ1 VSSQ NC DQ2 VDDQ NC DQ3 VSSQ NC NC VDDQ NC NC VDD NC NC WE CAS RAS CS NC BA0 BA1 AP/A10 A0 A1 A2 A3 VDD 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28.
• 200MHz Clock, 400Mbps data rate.
• VDD= +2.6V + 0.10V, VDDQ= +2.6V + 0.10V
• Double-data-rate architecture; two data transfers per clock cycle
• Bidirectional data strobe(DQS)
• Four banks operation
• Differential clock inputs(CK and CK)
• DLL aligns DQ and DQS transition with CK transition
• MRS cycle with address key programs -. Read latency 3 (clock) for DDR400 , 2.5 (clock) for DDR333 -. Burst length (2, 4, 8) -. Burst type (sequential & interleave)
• All inputs except data & DM are sampled at the positive going edge of the system clock(CK)
• Data I/O transactions on both edges of data s.
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | K4H560838F-UCC4 |
Samsung semiconductor |
256Mb F-die DDR400 SDRAM | |
2 | K4H560838F-TC |
Samsung Semiconductor |
DDR SDRAM 256Mb F-die | |
3 | K4H560838F-TCC4 |
Samsung semiconductor |
256Mb F-die DDR400 SDRAM Specification | |
4 | K4H560838F-TCCC |
Samsung semiconductor |
256Mb F-die DDR400 SDRAM Specification | |
5 | K4H560838A-TCA0 |
Samsung |
128Mb DDR SDRAM | |
6 | K4H560838A-TCA2 |
Samsung |
128Mb DDR SDRAM | |
7 | K4H560838A-TCB0 |
Samsung |
128Mb DDR SDRAM | |
8 | K4H560838A-TLA0 |
Samsung |
128Mb DDR SDRAM | |
9 | K4H560838A-TLA2 |
Samsung |
128Mb DDR SDRAM | |
10 | K4H560838A-TLB0 |
Samsung |
128Mb DDR SDRAM | |
11 | K4H560838B |
Samsung |
128Mb DDR SDRAM | |
12 | K4H560838B-TCA0 |
Samsung |
128Mb DDR SDRAM |