HSP061-4NY8 - ST Microelectronics

HSP061-4NY8 4-line ESD protection

HSP053-4M5 4-line ESD protection for high speed lines Datasheet - production data µQFN-5L package Features  Very compact 500 µm pitch package, for easy PCB layout  Ultra-large bandwidth: 18 GHz  Ultra-low capacitance: 0.15 pF (I/O to I/O) and 0.25 pF (I/O to GND)  Low leakage current: < 1 nA  Extended operating junction temperature range: -40 °C to 1.

Features

 Very compact 500 µm pitch package, for easy PCB layout
 Ultra-large bandwidth: 18 GHz
 Ultra-low capacitance: 0.15 pF (I/O to I/O) and 0.25 pF (I/O to GND)
 Low leakage current: < 1 nA
 Extended operating junction temperature range: -40 °C to 150 °C
 Thin package: 0.4 mm max.
 RoHS compliant Benefits
 High ESD protection level
 High integration
 Suitable for high density boards Complies with the following standards
 MIL-STD 883G method 3015-7 class 3B > 8 kV
 Exceeds IEC61000-4-2 level 4  ±10 kV (contact discharge)  ±25 kV (air discharge) Applications The HSP053-4M5 is designed.