FCSP1H40LTR - Vishay Siliconix

FCSP1H40LTR Chip Scale Package Schottky Barrier Rectifier

Vishay's FlipKY® product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in industry. The four bump 1.5 x 1.5 mm devices can deliver up to 1 A and occupy only 2.3 mm2 of board space. The anode and cathode connections are made through solder bump pads on one side of the silicon enabling desi.

Features

• Ultra low VF per footprint area
• Low leakage
• Low thermal resistance
• One-fifth footprint of SMA
• Super low profile (0.6 mm)
• Available tested on tape and reel RoHS COMPLIANT APPLICATIONS FlipKY®
• Reverse polarity protection
• Current steering
• Freewheeling
• Flyback
• Oring DESCRIPTION Vishay's FlipKY® product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in industry. The four bump 1.5 x 1.5 mm devices can deliver up to 1 A and occupy only 2.3 mm2 of board space. The anode and cathode connections are made thro.