FCSP0530ETR - Vishay Siliconix

FCSP0530ETR chip scale packaging to deliver Schottky diodes

FlipKY® product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in the industry. The three pad 0.9 mm x 1.2 mm devices can deliver up to 0.5 A and occupy only 1.08 mm2 of board space. The anode and cathode connections are made through solder bump pads on one side of the silicon rather than .

Features

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• Ultralow VF to footprint area Very low profile (< 0.6 mm ) Low thermal resistance Supplied tested and on tape and reel Designed for consumer level APPLICATIONS
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• Reverse polarity protection Current steering Freewheeling Flyback Oring FlipKY® DESCRIPTION FlipKY® product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in the industry. The three pad 0.9 mm x 1.2 mm devices can deliver up to 0.5 A and occupy only 1.08 mm2 of board space. The anode and cathode connections are made through solder bump pads on o.