FCSP07H40TR - Vishay Siliconix

FCSP07H40TR Chip Scale Package Schottky Barrier Rectifier

Vishay's FlipKY® product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in industry. The three pad 0.9 mm x 1.2 mm devices can deliver up to 0.75 A and occupy only 1.08 mm2 of board space. The anode and cathode connections are made through solder bump pads on one side of the silicon enabli.

Features

• Ultra low VF to footprint area
• Very low profile (< 0.6 mm)
• Low thermal resistance
• Supplied tested and on tape and reel RoHS COMPLIANT APPLICATIONS
• Reverse polarity protection
• Current steering
• Freewheeling FlipKY®
• Flyback
• Oring DESCRIPTION Vishay's FlipKY® product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in industry. The three pad 0.9 mm x 1.2 mm devices can deliver up to 0.75 A and occupy only 1.08 mm2 of board space. The anode and cathode connections are made through solder bump pads on one side .