l l D VDSS = -55V RDS(on) = 0.02Ω G ID = -74A S Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an.
pate up to 2.0W in a typical surface mount application. The through-hole version (IRF4905L) is available for lowprofile applications. D 2 Pak T O -2 6 2 Absolute Maximum Ratings Parameter ID @ TC = 25°C ID @ TC = 100°C IDM PD @TA = 25°C PD @TC = 25°C VGS EAS IAR EAR dv/dt TJ TSTG Continuous Drain Current, V GS @ -10V Continuous Drain Current, V GS @ -10V Pulsed Drain Current Power Dissipation Power Dissipation Linear Derating Factor Gate-to-Source Voltage Single Pulse Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Operating Junction and.
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | F497 |
Fujitsu Media Devices Limited |
16-bit Proprietary Microcontroller | |
2 | F49L800BA |
ESMT |
8 Mbit (1M x 8/512K x 16) 3V Only CMOS Flash Memory | |
3 | F49L800UA |
ESMT |
8 Mbit (1M x 8/512K x 16) 3V Only CMOS Flash Memory | |
4 | F4-100R12KS4 |
eupec |
IGBT | |
5 | F4-100R12KS4 |
Infineon |
IGBT | |
6 | F4-100R17ME4_B11 |
Infineon |
IGBT | |
7 | F4-150R12KS4 |
Infineon |
IGBT | |
8 | F4-150R17ME4_B11 |
Infineon |
IGBT | |
9 | F4-200R17N3E4 |
Infineon |
IGBT | |
10 | F4-250R17MP4_B11 |
Infineon |
IGBT | |
11 | F4-3L50R07W2H3F_B11 |
Infineon |
IGBT | |
12 | F4-50R06W1E3 |
Infineon |
IGBT |