for inductor L1) 12 Pin description for pin 7 changed 13 Cross-section view updated 16 Updated carrier tape drawing Trademarks of Infineon Technologies AG AURIX™, C166™, CanPAK™, CIPOS™, CIPURSE™, EconoPACK™, CoolMOS™, CoolSET™, CORECONTROL™, CROSSAVE™, DAVE™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPIM™, EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™.
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No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | BGM1032N7 |
Infineon |
GPS and GLONASS Front-End Module | |
2 | BGM1033N7 |
Infineon |
GPS and GLONASS Front-End Module | |
3 | BGM1011 |
NXP |
MMIC wideband amplifier | |
4 | BGM1012 |
PHILIPS |
MMIC wideband amplifier | |
5 | BGM1013 |
NXP |
MMIC wideband amplifier | |
6 | BGM1013 |
PHILIPS |
MMIC wideband amplifier | |
7 | BGM1014 |
PHILIPS |
MMIC wideband amplifier | |
8 | BGM1043N7 |
Infineon |
GPS and GLONASS Front-End Module | |
9 | BGM111 |
Silicon Laboratories |
Blue Gecko Bluetooth-Module | |
10 | BGM113 |
Silicon Laboratories |
Blue Gecko Bluetooth-Module | |
11 | BGM1143N9 |
Infineon |
Front-End Module | |
12 | BGM11S |
Silicon Labs |
Blue Gecko Bluetooth SiP-Module |