NPN medium power transistors in an ultra thin DFN2020D-3 (SOT1061D) leadless small Surface-Mounted Device (SMD) plastic package with medium power capability and visible and solderable side pads. PNP complement: BC69PAS series 1.2 Features and benefits High collector current capability Two current gain selections IC and ICM Reduced Printed-Circuit B.
High collector current capability
Two current gain selections
IC and ICM
Reduced Printed-Circuit Board (PCB)
Leadless very small SMD plastic
area requirements
package with medium power capability
Exposed heat sink for excellent thermal
Suitable for Automatic Optical
and electrical conductivity
Inspection (AOI) of solder joint
AEC-Q101 qualified
1.3 Applications
Linear voltage regulators
Battery driven devices
MOSFET drivers
Low-side switches
Power management
Amplifiers
1.4 Quick reference data
Table 1. Quick reference data Tamb = 25 C unless otherwise sp.
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | BC68PA |
nexperia |
2A NPN medium power transistors | |
2 | BC68F0031 |
Holtek Semiconductor |
I/O RF Transparent Transmission Flash MCU | |
3 | BC68F2123 |
Holtek Semiconductor |
Sub-1GHz OOK/FSK TX Soc 1K Flash MCU | |
4 | BC68F2130 |
Holtek Semiconductor |
Sub-1GHz RF Transmitter Flash MCU | |
5 | BC68F2140 |
Holtek Semiconductor |
Sub-1GHz RF Transmitter Flash MCU | |
6 | BC68F2332 |
Holtek Semiconductor |
Sub-1GHz Low-IF OOK RF Receiver Flash MCU | |
7 | BC68F2420 |
Holtek Semiconductor |
315/433MHz RF Super-regenerative Receiver SoC Flash MCU | |
8 | BC6130 |
CSR |
Fully Qualified Single-chip Bluetooth-v2.1+EDR | |
9 | BC6140 |
CSR |
Fully Qualified Single-chip Bluetooth v2.1 + EDR System | |
10 | BC6145 |
CSR |
Fully Qualified Single-chip Bluetooth v3.0 System | |
11 | BC617 |
Siemens Semiconductor Group |
NPN Silicon Darlington Transistors | |
12 | BC617 |
Motorola |
DARLINGTON TRANSISTORS |