AN17822A - Panasonic

AN17822A LOW-FREQUENCY AMPLIFIER

Chip surface passivation Lead frame material Inner lead surface process Others ( Others ( Others ( ) ) ) ) 1 2 , 6 2 6 3 4 4 5 5 7 *1 *1 Outer lead surface process Chip mounting method Wire bonding method Wire material Mold material Molding method Fin material Solder plating (98Sn-2Bi), Solder dip, Others ( Ag paste, Au-Si alloy, Solder (95.5Pb-2.5Ag-2.

Features

12S ∅ 3.6 6.4 ± 0.3 7.7 ± 0.3 12 7.8 ± 0.3 29.96 ± 0.3 28.0 ± 0.3 20.0±0.1 0.6 R1.8 1 1.2 ± 0.1 +0.1 0.25 -0.05 2.54 0.6 ± 0.1 Eff. Date 24-DEC-2003 Eff. Date -
*2 Eff. Date Eff. Date FMSC-PSDA-002-01 REV 1 28-MAR-05 Semiconductor Company, Matsushita Electric Industrial Co., Ltd. 3.5 ± 0.3 29.6 ± 0.3 Prepared Checked Lim Fuey Sheen Kenneth Law Product Specifications (Leadfree) Ref No. Total Page Page No. F 17 7A Approved Yasuo Higuchi AN17822A SiN, Fe group, Ag plating, PSG, Cu group, Au plating, (Structure Description) Chip surface passivation Lead frame material.