Recherchez avec le numéro de pièce ainsi que le fabricant ou la description
Thermal Considerations for PAs AN-0003 Thermal Considerations for Power Amplifiers Overview Proper heatsinking to control junction temperature is an extremely important consideration for use of all power amplifiers. Gallium Arsenide (GaAs) devices can tolerate considerably higher junction temperatures than Silicon (Si), but due to its lower thermal conducti.
rt under difficult thermal requirements. Application Requirements ANADIGICS power amplifiers are typically packaged in LPCC (Leadless Plastic Chip Carrier) packages. These packages offer excellent thermal characteristics due to the thin copper paddle used for mounting the chip. The part itself (bare die) is also very thin and enables very good heat dissipation. A cross section of the package is shown in Figure 1. Gold Wire Mold Compound DIE 0.9mm Lead Solder Plating Copper Lead Frame Die Attach Epoxy Figure 1. Cross section of an LPCC package. The thermal design of such a part involves ma.
| No. | Partie # | Fabricant | Description | Fiche Technique |
|---|---|---|---|---|
| 1 | AN-0001 |
ANADIGICS |
Surface Mount Assembly |
|
| 2 | AN-0002 |
ANADIGICS |
Biasing Circuits and Considerations |
|
| 3 | AN-0004 |
ANADIGICS |
12mm Tape |
|
| 4 | AN-1090 |
International Rectifier |
Controller Dynamics/Tuning |
|
| 5 | AN-136 |
Integrated Device Technology |
A NEW GENERATION |
|
| 6 | AN-1434 |
National Semiconductor |
Crest Factor Invariant RF Power Detector |
|
| 7 | AN-203 |
ZBasic |
I/O Expansion |
|
| 8 | AN-203 |
Analog Devices |
Using the AD2S80A Series Resolver-to-Digital Converters As a Controller Transformer |
|
| 9 | AN-214 |
National Semiconductor |
Transmission Line Drivers/Receivers |
|
| 10 | AN-242 |
National Semiconductor |
Applying a New Precision Op Amp |
|
| 11 | AN-4.0LAP |
ANCO ELECTRONICS |
TFT LCD |
|
| 12 | AN-4140 |
Fairchild Semiconductor |
Transformer Design Consideration |
|