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Assembly of LPCC Packages AN-0001 Surface Mount Assembly and Handling of ANADIGICS LPCC Packages 1.0 Overview ANADIGICS power amplifiers are typically packaged in a Leadless Plastic Chip Carrier (LPCC) package. These LPCC packages have two types of pads, mounting pads and a thermal pad, both of which must be correctly soldered for proper electrical contact t.
ning to be as tight as possible to ensure that some solder mask remains between PCB pads D = PCB land length = LPCC solder pad length + 0.1mm E = PCB land width = LPCC solder pad width Figure 1. PCB Land and Solder Mask Recommendations. 05/2003 http://www.Datasheet4U.com AN-0001 2. Plated-Through Holes or vias should not be used in the mounting pads for the IC circuit connections. 3. Thermal vias should be used on the PCB thermal pad (middle ground pad) to improve thermal conductivity from the device to a copper ground plane area on the reverse side of the printed circuit board. The number.
| No. | Partie # | Fabricant | Description | Fiche Technique |
|---|---|---|---|---|
| 1 | AN-0002 |
ANADIGICS |
Biasing Circuits and Considerations |
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| 2 | AN-0003 |
ANADIGICS |
Thermal Considerations |
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| 3 | AN-0004 |
ANADIGICS |
12mm Tape |
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| 4 | AN-1090 |
International Rectifier |
Controller Dynamics/Tuning |
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| 5 | AN-136 |
Integrated Device Technology |
A NEW GENERATION |
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| 6 | AN-1434 |
National Semiconductor |
Crest Factor Invariant RF Power Detector |
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| 7 | AN-203 |
ZBasic |
I/O Expansion |
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| 8 | AN-203 |
Analog Devices |
Using the AD2S80A Series Resolver-to-Digital Converters As a Controller Transformer |
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| 9 | AN-214 |
National Semiconductor |
Transmission Line Drivers/Receivers |
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| 10 | AN-242 |
National Semiconductor |
Applying a New Precision Op Amp |
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| 11 | AN-4.0LAP |
ANCO ELECTRONICS |
TFT LCD |
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| 12 | AN-4140 |
Fairchild Semiconductor |
Transformer Design Consideration |
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