1.1 Features 1 • Four TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed/Floating-Point DSP Core • 38.4 GMacs/Core for Fixed Point @ 1.2 GHz • 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory • 32K Byte L1P Per CorePac • 32K Byte L1D Per CorePac • 1024K Byte Local L2 Per CorePac • ARM CorePac – Two ARM® Cortex®-A.
and Description
1.1 Features
1
• Four TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With
– 1.0 GHz or 1.2 GHz C66x Fixed/Floating-Point DSP Core
• 38.4 GMacs/Core for Fixed Point @ 1.2 GHz
• 19.2 GFlops/Core for Floating Point @ 1.2 GHz
– Memory
• 32K Byte L1P Per CorePac
• 32K Byte L1D Per CorePac
• 1024K Byte Local L2 Per CorePac
• ARM CorePac
– Two ARM® Cortex®-A15 MPCore™ Processors at Up to 1.2 GHz
– 1MB L2 Cache Memory Shared by Two ARM Cores
– Full Implementation of ARMv7-A Architecture Instruction Set
– 32KB L1 Instruction and Data Caches per Core
– AMBA 4.0 AXI Coherency Exten.
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | 66AK2E02 |
Texas Instruments |
SoC | |
2 | 66AK2E05 |
Texas Instruments |
SoC | |
3 | 66AK2G12 |
Texas Instruments |
Multicore DSP+Arm KeyStone-II System-on-Chip | |
4 | 66AK2H06 |
Texas Instruments |
SoC | |
5 | 66AK2H12 |
Texas Instruments |
SoC | |
6 | 66AK2H14 |
Texas Instruments |
SoC | |
7 | 66004 |
Micropac Industries |
40kV HIGH VOLTAGE ISOLATOR WITH PHOTOTRANSISTOR or PHOTODARLINGTON OUTPUT/ CERAMIC PACKAGE | |
8 | 66005 |
Micropac Industries |
16kV HIGH VOLTAGE ISOLATOR WITH PHOTOTRANSISTOR or PHOTODARLINGTON OUTPUT/ CERAMIC PACKAGE | |
9 | 66012 |
Micropac Industries |
FOUR CHANNEL/ HERMETICALLY SEALED/ LOW-INPUT CURRENT/ 6N140 OPTOCOUPLER | |
10 | 66013 |
Micropac Industries |
DUAL CHANNEL/ HERMETICALLY SEALED/ HIGH-SPEED 6N134 OPTOCOUPLER | |
11 | 66015 |
Micropac Industries |
SINGLE CHANNEL OPTOCOUPLERS(REPLACEMENT FOR TIL 120/ TIL 121) | |
12 | 66024 |
Micropac Industries |
4N55 DUAL CHANNEL/ HERMETICALLY SEALED OPTOCOUPLER |