1.1 Features 1 • ARM® Cortex®-A15 MPCore™ CorePac – Up to Four ARM Cortex-A15 Processor Cores at up to 1.4-GHz – 4MB L2 Cache Memory Shared by all CortexA15 Processor Cores – Full Implementation of ARMv7-A Architecture Instruction Set – 32KB L1 Instruction and Data Caches per Core – AMBA 4.0 AXI Coherency Extension (ACE) Master Port, Connected to MSMC (Mult.
and Description
1.1 Features
1
• ARM® Cortex®-A15 MPCore™ CorePac
– Up to Four ARM Cortex-A15 Processor Cores at up to 1.4-GHz
– 4MB L2 Cache Memory Shared by all CortexA15 Processor Cores
– Full Implementation of ARMv7-A Architecture Instruction Set
– 32KB L1 Instruction and Data Caches per Core
– AMBA 4.0 AXI Coherency Extension (ACE) Master Port, Connected to MSMC (Multicore Shared Memory Controller) for Low Latency Access to SRAM and DDR3
• One TMS320C66x DSP Core Subsystem (C66x CorePacs), Each With
– 1.4 GHz C66x Fixed/Floating-Point DSP Core
• 38.4 GMacs/Core for Fixed Point @ 1.2 GHz .
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | 66AK2E05 |
Texas Instruments |
SoC | |
2 | 66AK2G12 |
Texas Instruments |
Multicore DSP+Arm KeyStone-II System-on-Chip | |
3 | 66AK2H06 |
Texas Instruments |
SoC | |
4 | 66AK2H12 |
Texas Instruments |
SoC | |
5 | 66AK2H14 |
Texas Instruments |
SoC | |
6 | 66AK2L06 |
Texas Instruments |
SoC | |
7 | 66004 |
Micropac Industries |
40kV HIGH VOLTAGE ISOLATOR WITH PHOTOTRANSISTOR or PHOTODARLINGTON OUTPUT/ CERAMIC PACKAGE | |
8 | 66005 |
Micropac Industries |
16kV HIGH VOLTAGE ISOLATOR WITH PHOTOTRANSISTOR or PHOTODARLINGTON OUTPUT/ CERAMIC PACKAGE | |
9 | 66012 |
Micropac Industries |
FOUR CHANNEL/ HERMETICALLY SEALED/ LOW-INPUT CURRENT/ 6N140 OPTOCOUPLER | |
10 | 66013 |
Micropac Industries |
DUAL CHANNEL/ HERMETICALLY SEALED/ HIGH-SPEED 6N134 OPTOCOUPLER | |
11 | 66015 |
Micropac Industries |
SINGLE CHANNEL OPTOCOUPLERS(REPLACEMENT FOR TIL 120/ TIL 121) | |
12 | 66024 |
Micropac Industries |
4N55 DUAL CHANNEL/ HERMETICALLY SEALED OPTOCOUPLER |