No. | Partie # | Fabricant | Description | Fiche Technique |
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YFD |
1.0 AMP. SURFACE MOUNT GENERAL PURPOSE ULTRA FAST RECTIFIERS SOD-123FL ·Glass passivated device ·Ideal for surface mouted applications ·Low reverse leakage ·Metallurgically bonded construction ·Superfast recovery time for high efficiency ·High temperature soldering guaranteed: 250℃/10 seconds at terminals. |
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YFD |
1.0 AMP. SURFACE MOUNT GENERAL PURPOSE ULTRA FAST RECTIFIERS SOD-123FL ·Glass passivated device ·Ideal for surface mouted applications ·Low reverse leakage ·Metallurgically bonded construction ·Superfast recovery time for high efficiency ·High temperature soldering guaranteed: 250℃/10 seconds at terminals. |
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YFD |
1.0 AMP. SURFACE MOUNT GENERAL PURPOSE ULTRA FAST RECTIFIERS SOD-123FL ·Glass passivated device ·Ideal for surface mouted applications ·Low reverse leakage ·Metallurgically bonded construction ·Superfast recovery time for high efficiency ·High temperature soldering guaranteed: 250℃/10 seconds at terminals. |
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YFD |
1.0 AMP. SURFACE MOUNT GENERAL PURPOSE ULTRA FAST RECTIFIERS SOD-123FL ·Glass passivated device ·Ideal for surface mouted applications ·Low reverse leakage ·Metallurgically bonded construction ·Superfast recovery time for high efficiency ·High temperature soldering guaranteed: 250℃/10 seconds at terminals. |
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YFD |
1.0 AMP. SURFACE MOUNT GENERAL PURPOSE ULTRA FAST RECTIFIERS SOD-123FL ·Glass passivated device ·Ideal for surface mouted applications ·Low reverse leakage ·Metallurgically bonded construction ·Superfast recovery time for high efficiency ·High temperature soldering guaranteed: 250℃/10 seconds at terminals. |
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YFD |
1.0 AMP. SURFACE MOUNT GENERAL PURPOSE ULTRA FAST RECTIFIERS SOD-123FL ·Glass passivated device ·Ideal for surface mouted applications ·Low reverse leakage ·Metallurgically bonded construction ·Superfast recovery time for high efficiency ·High temperature soldering guaranteed: 250℃/10 seconds at terminals. |
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YFD |
1.0 AMP. SURFACE MOUNT GENERAL PURPOSE ULTRA FAST RECTIFIERS SOD-123FL ·Glass passivated device ·Ideal for surface mouted applications ·Low reverse leakage ·Metallurgically bonded construction ·Superfast recovery time for high efficiency ·High temperature soldering guaranteed: 250℃/10 seconds at terminals. |
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