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YFD GS2 DataSheet

No. Partie # Fabricant Description Fiche Technique
1
GS2G

YFD
2AMP. GLASS PASSIVATED SURFACE MOUNT RECTIFIERS
.High current capability, .Low forward voltage drop .Low power loss, high efficiency .High surge capability .High temperature soldering guaranteed Fig1: SMA/DO-214AC* FOR OPEN JUNCTION DICE PACKAGING OUTLINE 260°C /1 0sec/0.375" lead length at 5 l
Datasheet
2
GS2J

YFD
2AMP. GLASS PASSIVATED SURFACE MOUNT RECTIFIERS
.High current capability, .Low forward voltage drop .Low power loss, high efficiency .High surge capability .High temperature soldering guaranteed Fig1: SMA/DO-214AC* FOR OPEN JUNCTION DICE PACKAGING OUTLINE 260°C /1 0sec/0.375" lead length at 5 l
Datasheet
3
GS2A

YFD
2AMP. GLASS PASSIVATED SURFACE MOUNT RECTIFIERS
.High current capability, .Low forward voltage drop .Low power loss, high efficiency .High surge capability .High temperature soldering guaranteed Fig1: SMA/DO-214AC* FOR OPEN JUNCTION DICE PACKAGING OUTLINE 260°C /1 0sec/0.375" lead length at 5 l
Datasheet
4
GS2B

YFD
2AMP. GLASS PASSIVATED SURFACE MOUNT RECTIFIERS
.High current capability, .Low forward voltage drop .Low power loss, high efficiency .High surge capability .High temperature soldering guaranteed Fig1: SMA/DO-214AC* FOR OPEN JUNCTION DICE PACKAGING OUTLINE 260°C /1 0sec/0.375" lead length at 5 l
Datasheet
5
GS2D

YFD
2AMP. GLASS PASSIVATED SURFACE MOUNT RECTIFIERS
.High current capability, .Low forward voltage drop .Low power loss, high efficiency .High surge capability .High temperature soldering guaranteed Fig1: SMA/DO-214AC* FOR OPEN JUNCTION DICE PACKAGING OUTLINE 260°C /1 0sec/0.375" lead length at 5 l
Datasheet
6
GS2K

YFD
2AMP. GLASS PASSIVATED SURFACE MOUNT RECTIFIERS
.High current capability, .Low forward voltage drop .Low power loss, high efficiency .High surge capability .High temperature soldering guaranteed Fig1: SMA/DO-214AC* FOR OPEN JUNCTION DICE PACKAGING OUTLINE 260°C /1 0sec/0.375" lead length at 5 l
Datasheet
7
GS2M

YFD
2AMP. GLASS PASSIVATED SURFACE MOUNT RECTIFIERS
.High current capability, .Low forward voltage drop .Low power loss, high efficiency .High surge capability .High temperature soldering guaranteed Fig1: SMA/DO-214AC* FOR OPEN JUNCTION DICE PACKAGING OUTLINE 260°C /1 0sec/0.375" lead length at 5 l
Datasheet



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