WON-TOP HD2 fiche technique

No.	Partie #	Fabricant	Description
1	HD2505	WON-TOP	25A GLASS PASSIVATED HITACHI TYPE PRESS-FIT DIODE  Glass Passivated Die Construction  Low Leakage  Low Cost  High Surge Current Capability  Typical IR less than 5.0µA  C-Band Terminal Construction Mechanical Data  Case: 12mm Hitachi Type Press-Fit  Terminals: Contact Areas Readily Solderabl
2	HD2506	WON-TOP	25A GLASS PASSIVATED HITACHI TYPE PRESS-FIT DIODE  Glass Passivated Die Construction  Low Leakage  Low Cost  High Surge Current Capability  Typical IR less than 5.0µA  C-Band Terminal Construction Mechanical Data  Case: 12mm Hitachi Type Press-Fit  Terminals: Contact Areas Readily Solderabl
3	HD2504	WON-TOP	25A GLASS PASSIVATED HITACHI TYPE PRESS-FIT DIODE  Glass Passivated Die Construction  Low Leakage  Low Cost  High Surge Current Capability  Typical IR less than 5.0µA  C-Band Terminal Construction Mechanical Data  Case: 12mm Hitachi Type Press-Fit  Terminals: Contact Areas Readily Solderabl
4	HD2503	WON-TOP	25A GLASS PASSIVATED HITACHI TYPE PRESS-FIT DIODE  Glass Passivated Die Construction  Low Leakage  Low Cost  High Surge Current Capability  Typical IR less than 5.0µA  C-Band Terminal Construction Mechanical Data  Case: 12mm Hitachi Type Press-Fit  Terminals: Contact Areas Readily Solderabl
5	HD2502	WON-TOP	25A GLASS PASSIVATED HITACHI TYPE PRESS-FIT DIODE  Glass Passivated Die Construction  Low Leakage  Low Cost  High Surge Current Capability  Typical IR less than 5.0µA  C-Band Terminal Construction Mechanical Data  Case: 12mm Hitachi Type Press-Fit  Terminals: Contact Areas Readily Solderabl
6	HD2500	WON-TOP	25A GLASS PASSIVATED HITACHI TYPE PRESS-FIT DIODE  Glass Passivated Die Construction  Low Leakage  Low Cost  High Surge Current Capability  Typical IR less than 5.0µA  C-Band Terminal Construction Mechanical Data  Case: 12mm Hitachi Type Press-Fit  Terminals: Contact Areas Readily Solderabl
7	HD2501	WON-TOP	25A GLASS PASSIVATED HITACHI TYPE PRESS-FIT DIODE  Glass Passivated Die Construction  Low Leakage  Low Cost  High Surge Current Capability  Typical IR less than 5.0µA  C-Band Terminal Construction Mechanical Data  Case: 12mm Hitachi Type Press-Fit  Terminals: Contact Areas Readily Solderabl