WON-TOP D4K fiche technique

No.	Partie #	Fabricant	Description
1	D4KB05	WON-TOP	4.0A GLASS PASSIVATED SINGLE PHASE BRIDGE RECTIFIER  Compact Package 3.1mm Case Thickness  Glass Passivated Die Construction  Low Forward Voltage Drop  High Forward Current Capability  High Reliability  High Surge Current Capability  Ideal for Printed Circuit Boards E G Mechanical Data  Case
2	D4KB10	WON-TOP	4.0A GLASS PASSIVATED SINGLE PHASE BRIDGE RECTIFIER  Compact Package 3.1mm Case Thickness  Glass Passivated Die Construction  Low Forward Voltage Drop  High Forward Current Capability  High Reliability  High Surge Current Capability  Ideal for Printed Circuit Boards E G Mechanical Data  Case
3	D4KB40	WON-TOP	4.0A GLASS PASSIVATED SINGLE PHASE BRIDGE RECTIFIER  Compact Package 3.1mm Case Thickness  Glass Passivated Die Construction  Low Forward Voltage Drop  High Forward Current Capability  High Reliability  High Surge Current Capability  Ideal for Printed Circuit Boards E G Mechanical Data  Case
4	D4KB80	WON-TOP	4.0A GLASS PASSIVATED SINGLE PHASE BRIDGE RECTIFIER  Compact Package 3.1mm Case Thickness  Glass Passivated Die Construction  Low Forward Voltage Drop  High Forward Current Capability  High Reliability  High Surge Current Capability  Ideal for Printed Circuit Boards E G Mechanical Data  Case
5	D4KB20	WON-TOP	4.0A GLASS PASSIVATED SINGLE PHASE BRIDGE RECTIFIER  Compact Package 3.1mm Case Thickness  Glass Passivated Die Construction  Low Forward Voltage Drop  High Forward Current Capability  High Reliability  High Surge Current Capability  Ideal for Printed Circuit Boards E G Mechanical Data  Case
6	D4KB60	WON-TOP	4.0A GLASS PASSIVATED SINGLE PHASE BRIDGE RECTIFIER  Compact Package 3.1mm Case Thickness  Glass Passivated Die Construction  Low Forward Voltage Drop  High Forward Current Capability  High Reliability  High Surge Current Capability  Ideal for Printed Circuit Boards E G Mechanical Data  Case
7	D4KB100	WON-TOP	4.0A GLASS PASSIVATED SINGLE PHASE BRIDGE RECTIFIER  Compact Package 3.1mm Case Thickness  Glass Passivated Die Construction  Low Forward Voltage Drop  High Forward Current Capability  High Reliability  High Surge Current Capability  Ideal for Printed Circuit Boards E G Mechanical Data  Case