No. | Partie # | Fabricant | Description | Fiche Technique |
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WILLAS |
SINGLE-PHASE SILICON BRIDGE RECTIFIER • Batch process design, excellent power dissipation offers Package outline better reverse leakage current and thermal resistance. SOD-123H FEATUR •ELSow profile surface mounted application in order to * Low leakaogpetimize board space. M C C EETSS |
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WILLAS |
SINGLE-PHASE SILICON BRIDGE RECTIFIER • Batch process design, excellent power dissipation offers Package outline better reverse leakage current and thermal resistance. SOD-123H FEATUR •ELSow profile surface mounted application in order to * Low leakaogpetimize board space. M C C EETSS |
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WILLAS |
SINGLE-PHASE SILICON BRIDGE RECTIFIER • Batch process design, excellent power dissipation offers Package outline better reverse leakage current and thermal resistance. SOD-123H FEATUR •ELSow profile surface mounted application in order to * Low leakaogpetimize board space. M C C EETSS |
|
|
|
WILLAS |
SINGLE-PHASE SILICON BRIDGE RECTIFIER • Batch process design, excellent power dissipation offers Package outline better reverse leakage current and thermal resistance. SOD-123H FEATUR •ELSow profile surface mounted application in order to * Low leakaogpetimize board space. M C C EETSS |
|
|
|
WILLAS |
SINGLE-PHASE SILICON BRIDGE RECTIFIER • Batch process design, excellent power dissipation offers Package outline better reverse leakage current and thermal resistance. SOD-123H FEATUR •ELSow profile surface mounted application in order to * Low leakaogpetimize board space. M C C EETSS |
|
|
|
WILLAS |
SINGLE-PHASE SILICON BRIDGE RECTIFIER • Batch process design, excellent power dissipation offers Package outline better reverse leakage current and thermal resistance. SOD-123H FEATUR •ELSow profile surface mounted application in order to * Low leakaogpetimize board space. M C C EETSS |
|
|
|
WILLAS |
SINGLE-PHASE SILICON BRIDGE RECTIFIER • Batch process design, excellent power dissipation offers Package outline better reverse leakage current and thermal resistance. SOD-123H FEATUR •ELSow profile surface mounted application in order to * Low leakaogpetimize board space. M C C EETSS |
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