| No. | Partie # | Fabricant | Description | Fiche Technique |
|---|---|---|---|---|
|
|
|
WILLAS |
30.0A SCHOTTKY BARRIER RECTIFIERS • Batch process design, excellent power dissipation offers MecbhetatenrircevaelrsDealetaekage current and thermal resistance. • Low profile surface mounted application in order to ‧Caospeti:mTiOze-2b2oa0rd space. ‧C • •aHLsoiegwhMpcouawrtreeerrniltaocs |
|
|
|
|
WILLAS |
30.0A SCHOTTKY BARRIER RECTIFIERS • Batch process design, excellent power dissipation offers MecbhetatenrircevaelrsDealetaekage current and thermal resistance. • Low profile surface mounted application in order to ‧Caospeti:mTiOze-2b2oa0rd space. ‧C • •aHLsoiegwhMpcouawrtreeerrniltaocs |
|
|
|
|
WILLAS |
30.0A SCHOTTKY BARRIER RECTIFIERS • Batch process design, excellent power dissipation offers Package outline better reverse leakage current and thermal resistance. • Low profile surface mounted application in order to MechanopitcimailzeDbaotaerd space. ‧Case • • :HLToiOgwh-p2cou4w |
|
|
|
|
WILLAS |
30.0A SCHOTTKY BARRIER RECTIFIERS • Batch process design, excellent power dissipation offers Package outline better reverse leakage current and thermal resistance. • Low profile surface mounted application in order to MechanopitcimailzeDbaotaerd space. ‧Case • • :HLToiOgwh-p2cou4w |
|
|
|
|
WILLAS |
SCHOTTKY BARRIER RECTIFIER Package outline • Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance. • Low profile surface mounted application in order to SOD-123H optimize board space. • Low power loss, high effici |
|
|
|
|
WILLAS |
40.0A SCHOTTKY BARRIER RECTIFIERS • Batch process design, excellent power dissipation offers Mecbhetatenr ircevaelrsDealetaekage current and thermal resistance. • Low profile surface mounted application in order to ‧Caospeti:mTiOze-2bo2a0rd space. ‧C • •aHLsoigewhMpcouawrtreeerrniltoac |
|
|
|
|
WILLAS |
20.0A SCHOTTKY BARRIER RECTIFIERS • Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance. • Low profile surface mounted application in order to optimize board space. Features • Low power loss, high efficiency. • High curre |
|
|
|
|
WILLAS |
40.0A SCHOTTKY BARRIER RECTIFIERS Package outline • Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance. • Low profile surface mounted application in order to Mecha • nLoopicwtimapliozwDeebarotlaeorsds,shpiagchee. fficiency |
|
|
|
|
WILLAS |
30.0A SCHOTTKY BARRIER RECTIFIERS • Batch process design, excellent power dissipation offers Package outline better reverse leakage current and thermal resistance. • Low profile surface mounted application in order to MechanopitcimailzeDbaotaerd space. ‧Case • • :HLToiOgwh-p2cou4w |
|
|
|
|
WILLAS |
10A Low VF Trench MOS Schottky Rectifiers EXTREMELY LOW VF TRENCH MOS SCHOTTKY TECHNOLOGY LOW POWER LOSS / HIGH EFFICIENCY HIGH FREQENCY OPERATION HALOGEN FREE HIGH FORWARD SURGE CAPABILITY MOISTURE SENSITIVITY LEVEL 1 TO-220 ● Body Marking Example PACKAGE Logo VYM Date Co |
|
|
|
|
WILLAS |
SCHOTTKY BARRIER RECTIFIER Package outline • Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance. • Low profile surface mounted application in order to SOD-123H optimize board space. • Low power loss, high effici |
|
|
|
|
WILLAS ELECTRONIC |
10.0A SCHOTTKY BARRIER RECTIFIERS Package outline SOD-123H • Low profile surface mounted application in order to optimize board space. Features • Low power loss, high efficiency. • High current capability, low forward voltage drop. surge capability. • • High High Junction Temperat |
|
|
|
|
WILLAS |
10.0A SCHOTTKY BARRIER RECTIFIERS Package outline • Batch process design, excellent power dissipation offers Mecbhetatenr ircevaelrsDealetaekage current and thermal resistance. • Low profile surface mounted application in order to ‧Caospeti:mITizOe -b2o2a0rd space. ‧C • •aHLsoigewhM |
|
|
|
|
WILLAS |
10.0A SCHOTTKY BARRIER RECTIFIERS Package outline • Batch process design, excellent power dissipation offers Mecbhetatenr ircevaelrsDealetaekage current and thermal resistance. • Low profile surface mounted application in order to ‧Caospeti:mITizOe -b2o2a0rd space. ‧C • •aHLsoigewhM |
|
|
|
|
WILLAS |
30.0A SCHOTTKY BARRIER RECTIFIERS • Batch process design, excellent power dissipation offers MecbhetatenrircevaelrsDealetaekage current and thermal resistance. • Low profile surface mounted application in order to ‧Caospeti:mTiOze-2b2oa0rd space. ‧C • •aHLsoiegwhMpcouawrtreeerrniltaocs |
|
|
|
|
WILLAS |
30.0A SCHOTTKY BARRIER RECTIFIERS • Batch process design, excellent power dissipation offers MecbhetatenrircevaelrsDealetaekage current and thermal resistance. • Low profile surface mounted application in order to ‧Caospeti:mTiOze-2b2oa0rd space. ‧C • •aHLsoiegwhMpcouawrtreeerrniltaocs |
|
|
|
|
WILLAS |
40.0A SCHOTTKY BARRIER RECTIFIERS • Batch process design, excellent power dissipation offers Mecbhetatenr ircevaelrsDealetaekage current and thermal resistance. • Low profile surface mounted application in order to ‧Caospeti:mTiOze-2bo2a0rd space. ‧C • •aHLsoigewhMpcouawrtreeerrniltoac |
|
|
|
|
WILLAS |
40.0A SCHOTTKY BARRIER RECTIFIERS • Batch process design, excellent power dissipation offers Mecbhetatenr ircevaelrsDealetaekage current and thermal resistance. • Low profile surface mounted application in order to ‧Caospeti:mTiOze-2bo2a0rd space. ‧C • •aHLsoigewhMpcouawrtreeerrniltoac |
|
|
|
|
WILLAS |
40.0A SCHOTTKY BARRIER RECTIFIERS Package outline • Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance. • Low profile surface mounted application in order to Mecha • nLoopicwtimapliozwDeebarotlaeorsds,shpiagchee. fficiency |
|
|
|
|
WILLAS |
30.0A SCHOTTKY BARRIER RECTIFIERS • Batch process design, excellent power dissipation offers Package outline better reverse leakage current and thermal resistance. • Low profile surface mounted application in order to MechanopitcimailzeDbaotaerd space. ‧Case • • :HLToiOgwh-p2cou4w |
|