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WILLAS |
500mW AXIAL LEAD ZENER DIODE • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes 1.02(26.0)MIN. .018(0.45) .014(0.35) .116(2.90) .092(2.30) MECHANICAL DATA • Case: Molded Glass DO-34 • Terminals: Solderable per MIL-STD-202, M |
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WILLAS |
500mW AXIAL LEAD ZENER DIODE • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes 1.02(26.0)MIN. .018(0.45) .014(0.35) .116(2.90) .092(2.30) MECHANICAL DATA • Case: Molded Glass DO-34 • Terminals: Solderable per MIL-STD-202, M |
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WILLAS |
500mW AXIAL LEAD ZENER DIODE • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes 1.02(26.0)MIN. .018(0.45) .014(0.35) .116(2.90) .092(2.30) MECHANICAL DATA • Case: Molded Glass DO-34 • Terminals: Solderable per MIL-STD-202, M |
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WILLAS |
500mW AXIAL LEAD ZENER DIODE • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes 1.02(26.0)MIN. .018(0.45) .014(0.35) .116(2.90) .092(2.30) MECHANICAL DATA • Case: Molded Glass DO-34 • Terminals: Solderable per MIL-STD-202, M |
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WILLAS |
500mW AXIAL LEAD ZENER DIODE • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes 1.02(26.0)MIN. .018(0.45) .014(0.35) .116(2.90) .092(2.30) MECHANICAL DATA • Case: Molded Glass DO-34 • Terminals: Solderable per MIL-STD-202, M |
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WILLAS |
500mW AXIAL LEAD ZENER DIODE • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes 1.02(26.0)MIN. .018(0.45) .014(0.35) .116(2.90) .092(2.30) MECHANICAL DATA • Case: Molded Glass DO-34 • Terminals: Solderable per MIL-STD-202, M |
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WILLAS |
500mW AXIAL LEAD ZENER DIODE • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes 1.02(26.0)MIN. .018(0.45) .014(0.35) .116(2.90) .092(2.30) MECHANICAL DATA • Case: Molded Glass DO-34 • Terminals: Solderable per MIL-STD-202, M |
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WILLAS |
500mW AXIAL LEAD ZENER DIODE • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes 1.02(26.0)MIN. .018(0.45) .014(0.35) .116(2.90) .092(2.30) MECHANICAL DATA • Case: Molded Glass DO-34 • Terminals: Solderable per MIL-STD-202, M |
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WILLAS |
500mW AXIAL LEAD ZENER DIODE • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes 1.02(26.0)MIN. .018(0.45) .014(0.35) .116(2.90) .092(2.30) MECHANICAL DATA • Case: Molded Glass DO-34 • Terminals: Solderable per MIL-STD-202, M |
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WILLAS |
500mW AXIAL LEAD ZENER DIODE • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes 1.02(26.0)MIN. .018(0.45) .014(0.35) .116(2.90) .092(2.30) MECHANICAL DATA • Case: Molded Glass DO-34 • Terminals: Solderable per MIL-STD-202, M |
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WILLAS |
500mW AXIAL LEAD ZENER DIODE • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes 1.02(26.0)MIN. .018(0.45) .014(0.35) .116(2.90) .092(2.30) MECHANICAL DATA • Case: Molded Glass DO-34 • Terminals: Solderable per MIL-STD-202, M |
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WILLAS |
500mW AXIAL LEAD ZENER DIODE • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes 1.02(26.0)MIN. .018(0.45) .014(0.35) .116(2.90) .092(2.30) MECHANICAL DATA • Case: Molded Glass DO-34 • Terminals: Solderable per MIL-STD-202, M |
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WILLAS |
500mW AXIAL LEAD ZENER DIODE • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes 1.02(26.0)MIN. .018(0.45) .014(0.35) .116(2.90) .092(2.30) MECHANICAL DATA • Case: Molded Glass DO-34 • Terminals: Solderable per MIL-STD-202, M |
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WILLAS |
500mW AXIAL LEAD ZENER DIODE • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes 1.02(26.0)MIN. .018(0.45) .014(0.35) .116(2.90) .092(2.30) MECHANICAL DATA • Case: Molded Glass DO-34 • Terminals: Solderable per MIL-STD-202, M |
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WILLAS |
500mW AXIAL LEAD ZENER DIODE • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes 1.02(26.0)MIN. .018(0.45) .014(0.35) .116(2.90) .092(2.30) MECHANICAL DATA • Case: Molded Glass DO-34 • Terminals: Solderable per MIL-STD-202, M |
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WILLAS |
500mW AXIAL LEAD ZENER DIODE • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes 1.02(26.0)MIN. .018(0.45) .014(0.35) .116(2.90) .092(2.30) MECHANICAL DATA • Case: Molded Glass DO-34 • Terminals: Solderable per MIL-STD-202, M |
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WILLAS |
500mW AXIAL LEAD ZENER DIODE • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes 1.02(26.0)MIN. .018(0.45) .014(0.35) .116(2.90) .092(2.30) MECHANICAL DATA • Case: Molded Glass DO-34 • Terminals: Solderable per MIL-STD-202, M |
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WILLAS |
500mW AXIAL LEAD ZENER DIODE • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes 1.02(26.0)MIN. .018(0.45) .014(0.35) .116(2.90) .092(2.30) MECHANICAL DATA • Case: Molded Glass DO-34 • Terminals: Solderable per MIL-STD-202, M |
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WILLAS |
500mW AXIAL LEAD ZENER DIODE • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes 1.02(26.0)MIN. .018(0.45) .014(0.35) .116(2.90) .092(2.30) MECHANICAL DATA • Case: Molded Glass DO-34 • Terminals: Solderable per MIL-STD-202, M |
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WILLAS |
500mW AXIAL LEAD ZENER DIODE • Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes 1.02(26.0)MIN. .018(0.45) .014(0.35) .116(2.90) .092(2.30) MECHANICAL DATA • Case: Molded Glass DO-34 • Terminals: Solderable per MIL-STD-202, M |
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