No. | Partie # | Fabricant | Description | Fiche Technique |
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WILLAS |
PNP Digital Transistor • Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance. • Low profile surface mounted application in order to optimize board space. • Low power loss, high efficiency. Features • High current ca |
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WILLAS |
PNP Digital Transistor Package outline • Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance. • Low profile surface mounted application in order to SOD-123H .004(0.10)MIN. .096(2.45) .078(2.00) Featuresoptimi |
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WILLAS |
PNP Digital Transistor Package outline Features • Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance. • Low profile surface mounted application in order to • Pb-Freoeptpimaiczke abgoaerdisspaavcea.ilable SOD-123 |
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WILLAS |
PNP Digital Transistor • Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance. • Low profile surface mounted application in order to optimize board space. • Low power loss, high efficiency. Features • High curr |
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WILLAS |
PNP Digital Transistor Package outline • Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance. • Low profile surface mounted application in order to SOD-123H Featuresoptimize board space. • Low power loss, high |
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WILLAS |
PNP Digital Transistor Package outline • Batch process design, excellent power dissipation offers Featuresbetter reverse leakage current and thermal resistance. • Low profile surface mounted application in order to • Pb-Froepetimpizaecbkoaagrdespisacae.vailable RoH •SLop |
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WILLAS |
PNP Digital Transistor • Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance. • Low profile surface mounted application in order to Featuresoptimize board space. • Pb-Fre • •eHLpoigwahcpcokuwarregerneltocsisasp, |
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