| No. | Partie # | Fabricant | Description | Fiche Technique |
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WILLAS |
Power MOSFET Package outline • Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance. • Low profile surface mounted application in order to SOD-123H optimize board space. N – •CLohwaponwner eloslsS, hiOg |
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WILLAS |
Power MOSFET Package outline • Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance. • Low profile surface mounted application in order to SOD-123H optimize board space. P • –LCowhpoawnernloessl, ShigO |
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