| No. | Partie # | Fabricant | Description | Fiche Technique |
|---|---|---|---|---|
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Vishay |
Single-Phase Single In-Line Bridge Rectifier • UL recognition file number E312394 (QQQX2) • Ideal for printed circuit boards • High surge current capability ~ ~ + Case Style GSIB-3S • High case dielectric strength of 1500 VRMS + ~ ~ - • Solder dip 260 °C, 40 s • Compliant to RoHS directive 20 |
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Vishay |
Single-Phase Single In-Line Bridge Rectifiers • UL recognition file number E54214 • Thin single in-line package • Glass passivated chip junction • High surge current capability • High case dielectric strength of 2500 VRMS • Solder dip 260 °C, 40 s • Material categorization: For definitions of co |
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Vishay |
Single-Phase Single In-Line Bridge Rectifiers • UL recognition file number E54214 • Thin single in-line package • Glass passivated chip junction • High surge current capability • High case dielectric strength of 2500 VRMS • Solder dip 260 °C, 40 s • Material categorization: For definitions of co |
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Vishay |
Single-Phase Single In-Line Bridge Rectifiers • UL recognition file number E54214 • Thin single in-line package • Glass passivated chip junction • High surge current capability • High case dielectric strength of 2500 VRMS • Solder dip 260 °C, 40 s • Component in accordance to RoHS 2002/95/EC and |
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|
Vishay |
Single-Phase Single In-Line Bridge Rectifiers • UL recognition file number E54214 • Thin single in-line package • Glass passivated chip junction • High surge current capability • High case dielectric strength of 2500 VRMS • Solder dip 260 °C, 40 s • Component in accordance to RoHS 2002/95/EC and |
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Vishay Siliconix |
Single-Phase Single In-Line Bridge Rectifiers • UL recognition file number E54214 • Thin single in-line package • Glass passivated chip junction • High surge current capability • High case dielectric strength of 1500 VRMS • Solder dip 260 °C, 40 s • Material categorization: For definitions of co |
|
|
|
|
Vishay |
Single-Phase Single In-Line Bridge Rectifiers • UL recognition file number E54214 • Thin single in-line package • Glass passivated chip junction • High surge current capability • High case dielectric strength of 1500 VRMS • Solder dip 260 °C, 40 s • Component in accordance to RoHS 2002/95/EC and |
|
|
|
|
Vishay |
Single-Phase Single In-Line Bridge Rectifiers • UL recognition file number E54214 • Thin single in-line package • Glass passivated chip junction • High surge current capability • High case dielectric strength of 1500 VRMS • Solder dip 260 °C, 40 s • Component in accordance to RoHS 2002/95/EC and |
|
|
|
|
Vishay |
Single-Phase Single In-Line Bridge Rectifiers • UL recognition file number E54214 • Thin single in-line package • Glass passivated chip junction • High surge current capability • High case dielectric strength of 1500 VRMS • Solder dip 260 °C, 40 s • Component in accordance to RoHS 2002/95/EC and |
|
|
|
|
Vishay |
Single-Phase Single In-Line Bridge Rectifiers • UL recognition file number E54214 • Thin single in-line package • Glass passivated chip junction • High surge current capability • High case dielectric strength of 1500 VRMS • Solder dip 260 °C, 40 s • Component in accordance to RoHS 2002/95/EC and |
|
|
|
|
Vishay |
Single-Phase Single In-Line Bridge Rectifiers • UL recognition file number E54214 • Thin single in-line package • Glass passivated chip junction • High surge current capability • High case dielectric strength of 2500 VRMS • Solder dip 260 °C, 40 s • Material categorization: For definitions of co |
|
|
|
|
Vishay |
Single-Phase Single In-Line Bridge Rectifiers • UL recognition file number E54214 • Thin single in-line package • Glass passivated chip junction • High surge current capability • High case dielectric strength of 2500 VRMS • Solder dip 260 °C, 40 s • Material categorization: For definitions of co |
|
|
|
|
Vishay |
Single-Phase Single In-Line Bridge Rectifiers • UL recognition file number E54214 • Thin single in-line package • Glass passivated chip junction • High surge current capability • High case dielectric strength of 2500 VRMS • Solder dip 260 °C, 40 s • Component in accordance to RoHS 2002/95/EC and |
|
|
|
|
Vishay |
Single-Phase Single In-Line Bridge Rectifiers • UL recognition file number E54214 • Thin single in-line package • Glass passivated chip junction • High surge current capability • High case dielectric strength of 2500 VRMS • Solder dip 260 °C, 40 s • Material categorization: For definitions of co |
|
|
|
|
Vishay |
Single-Phase Single In-Line Bridge Rectifiers • UL recognition file number E54214 • Thin single in-line package • Glass passivated chip junction • High surge current capability • High case dielectric strength of 2500 VRMS • Solder dip 260 °C, 40 s • Material categorization: For definitions of co |
|
|
|
|
Vishay |
Single-Phase Single In-Line Bridge Rectifiers • UL recognition file number E54214 • Thin single in-line package • Glass passivated chip junction • High surge current capability • High case dielectric strength of 2500 VRMS • Solder dip 260 °C, 40 s • Material categorization: For definitions of co |
|
|
|
|
Vishay |
Single-Phase Single In-Line Bridge Rectifiers • UL recognition file number E54214 • Thin single in-line package • Glass passivated chip junction • High surge current capability • High case dielectric strength of 2500 VRMS • Solder dip 260 °C, 40 s • Component in accordance to RoHS 2002/95/EC and |
|
|
|
|
Vishay |
Single-Phase Single In-Line Bridge Rectifier • UL recognition file number E312394 (QQQX2) • Ideal for printed circuit boards • High surge current capability ~ ~ + Case Style GSIB-3S • High case dielectric strength of 1500 VRMS + ~ ~ - • Solder dip 260 °C, 40 s • Compliant to RoHS directive 20 |
|
|
|
|
Vishay |
Single-Phase Single In-Line Bridge Rectifiers • UL recognition file number E54214 • Thin single in-line package • Glass passivated chip junction • High surge current capability • High case dielectric strength of 1500 VRMS • Solder dip 260 °C, 40 s • Material categorization: For definitions of co |
|
|
|
|
Vishay |
Single-Phase Single In-Line Bridge Rectifiers • UL recognition file number E54214 • Thin single in-line package • Glass passivated chip junction • High surge current capability • High case dielectric strength of 1500 VRMS • Solder dip 260 °C, 40 s • Material categorization: For definitions of co |
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