| No. | Partie # | Fabricant | Description | Fiche Technique |
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Vishay |
High Brightness LED Power Module • Cu based PCB, 2 mm thickness • Shiny white surface • 44 W multichip LED, minimum 2900 lm for cool white, 2600 lm for natural white, and 2100 lm for warm white at 2100 mA each • ESD withstand volt |
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Vishay |
High Brightness LED Power Module • Metal core PCB: Al > 1 thickness • Single side/single layer PCB • Shiny white surface • 6 or 12 LEDs minimum 87.4 lm at 350 mA each • Prepared to devide in half strips also, by cutting • Conductive top layer: Cu (min. 18 μm) • Isolation layer prepr |
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Vishay |
High Brightness LED Power Module • Cu based PCB, 1.2 mm thickness • Shiny white surface • 4.55 W multichip LED, minimum 390 lm for cool white, 330 lm for natural white, and 290 lm for warm white at 700 mA each • ESD withstan |
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Vishay |
AC Line Rated Ceramic Disc Capacitors • Complying with IEC 60384-14 3rd edition • High reliability • Radial leads • Singlelayer AC disc safety capacitors • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 QUICK REFERENCE DATA DESCRIPTION Ceramic |
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Vishay |
High Brightness LED Power Module • Metal core PCB: Al > 1 thickness • Single side/single layer PCB • Shiny white surface • 6 or 12 LEDs minimum 87.4 lm at 350 mA each • Prepared to devide in half strips also, by cutting • Conductive top layer: Cu (min. 18 μm) • Isolation layer prepr |
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Vishay |
High Brightness LED Power Module • Cu based PCB, 2 mm thickness • Shiny white surface • 44 W multichip LED, minimum 2900 lm for cool white, 2600 lm for natural white, and 2100 lm for warm white at 2100 mA each • ESD withstand volt |
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Vishay |
High Brightness LED Power Module • Cu based PCB, 2 mm thickness • Shiny white surface • 63 W multichip LED, minimum 4200 lm for cool white, 3950 lm for natural white, and 3000 lm for warm white at 3000 mA each • ESD |
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Vishay |
High Brightness LED Power Module • Cu based PCB, 2 mm thickness • Shiny white surface • 63 W multichip LED, minimum 4200 lm for cool white, 3950 lm for natural white, and 3000 lm for warm white at 3000 mA each • ESD |
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Vishay |
High Brightness LED Power Module • Metal core PCB: Al > 1 thickness • Single side/single layer PCB • Shiny white surface • 9 LEDs minimum 87 lm for cool white, 76 lm for natural white and 67 lm for warm white at 350 mA each • Conductive top layer: Cu (min. 18 μm) • Isolation layer p |
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Vishay |
High Brightness LED Power Module • Metal core PCB: Al > 1 thickness • Single side/single layer PCB • Shiny white surface • 9 LEDs, max. current per LED 1 A • Conductive top layer: Cu (min. 18 μm) • Isolation layer prepreg (100 μm) • ESD withstand voltage: up to 2 kV according to JES |
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Vishay |
High Brightness LED Power Module • Metal core PCB: Al > 1 thickness • Single side/single layer PCB • Shiny white surface • 6 or 12 LEDs, max. current per LED 1 A • Prepared to devide in half strips also, by cutting • Conductive top layer: Cu (min. 18 μm) • Isolation layer prepreg (1 |
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Vishay |
High Brightness LED Power Module • Metal core PCB: Al > 1 thickness • Single side/single layer PCB • Shiny white surface • 6 or 12 LEDs, max. current per LED 1 A • Prepared to devide in half strips also, by cutting • Conductive top layer: Cu (min. 18 μm) • Isolation layer prepreg (1 |
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Vishay |
High Brightness LED Power Module • Cu based PCB, 1.2 mm thickness • Shiny white surface • 4.4 W multichip LED, minimum 400 lm for cool white, 360 lm for natural white, and 300 lm for warm white at 700 mA each • ESD withstand voltage: up |
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Vishay Siliconix |
Phase Control Thyristors • Center gate • International standard case TO-209AC (TO-94) • Compression bonded encapsulation for heavy duty operations such as severe thermal cycling • Hermetic glass-metal case with (Glass-metal seal over 1200 V) TO-209AC (TO-94) ceramic insulat |
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Vishay Siliconix |
Phase Control Thyristors • Center gate • International standard case TO-209AC (TO-94) • Compression bonded encapsulation for heavy duty operations such as severe thermal cycling • Hermetic glass-metal case with (Glass-metal seal over 1200 V) TO-209AC (TO-94) ceramic insulat |
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Vishay |
High Brightness LED Power Module • Metal core PCB: Al > 1 thickness • Single side/single layer PCB • Shiny white surface • 6 or 12 LEDs minimum 87.4 lm at 350 mA each • Prepared to devide in half strips also, by cutting • Conductive top layer: Cu (min. 18 μm) • Isolation layer prepr |
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Vishay |
High Brightness LED Power Module • Cu based PCB, 2 mm thickness • Shiny white surface • 44 W multichip LED, minimum 2900 lm for cool white, 2600 lm for natural white, and 2100 lm for warm white at 2100 mA each • ESD withstand volt |
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Vishay |
High Brightness LED Power Module • Cu based PCB, 2 mm thickness • Shiny white surface • 63 W multichip LED, minimum 4200 lm for cool white, 3950 lm for natural white, and 3000 lm for warm white at 3000 mA each • ESD |
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Vishay |
High Brightness LED Power Module • Metal core PCB: Al > 1 mm thickness • Single side/single layer PCB • Shiny white surface • 4 LED’s in a row • Conductive top layer: Cu (min. 18 μm) • Isolation layer prepreg (100 μm) • ESD withstand voltage: up to 2 kV according to JESD22-A114-B • |
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Vishay |
High Brightness LED Power Module • Cu based PCB, 1.2 mm thickness • Shiny white surface • 4.55 W multichip LED, minimum 390 lm for cool white, 330 lm for natural white, and 290 lm for warm white at 700 mA each • ESD withstan |
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