| No. | Partie # | Fabricant | Description | Fiche Technique |
|---|---|---|---|---|
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Vishay |
Dual Common Cathode Ultrafast Rectifier • Power pack • Glass passivated pellet chip junction • Ultrafast recovery times • Soft recovery characteristics • Low switching losses, high efficiency • High forward surge capability • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material categor |
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Vishay |
Dual Common Cathode Ultrafast Rectifier • Power pack • Glass passivated pellet chip junction • Ultrafast recovery times • Soft recovery characteristics • Low switching losses, high efficiency • High forward surge capability • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material categor |
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Vishay |
Dual Common Cathode Ultrafast Rectifier • Power pack • Glass passivated chip junction • Ultrafast recovery time • Low switching losses, high efficiency • Low forward voltage drop • High forward surge capability • Solder dip 275 °C max., 10 s per JESD 22-B106 • Material categorization: For |
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Vishay |
Dual Common Cathode Ultrafast Rectifier • Power pack • Glass passivated pellet chip junction • Ultrafast recovery times • Soft recovery characteristics • Low switching losses, high efficiency • High forward surge capability • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material categor |
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|
Vishay |
Dual Common Cathode Ultrafast Rectifier • Power pack • Glass passivated chip junction • Ultrafast recovery time • Low switching losses, high efficiency • Low forward voltage drop • High forward surge capability • Solder dip 275 °C max., 10 s per JESD 22-B106 • Material categorization: For |
|
|
|
|
Vishay |
Dual Common Cathode Ultrafast Rectifier • Power pack • Glass passivated chip junction • Ultrafast recovery time • Low switching losses, high efficiency • Low forward voltage drop • High forward surge capability • Solder dip 275 °C max., 10 s per JESD 22-B106 • Material categorization: For |
|
|
|
|
Vishay |
Dual Common Cathode Ultrafast Rectifier • Power pack • Glass passivated chip junction • Ultrafast recovery time • Low switching losses, high efficiency • Low forward voltage drop • High forward surge capability • Solder dip 275 °C max., 10 s per JESD 22-B106 • Material categorization: For |
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