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Vishay UF4 DataSheet

No. Partie # Fabricant Description Fiche Technique
1
UF4004

Vishay
Ultrafast Plastic Rectifier

• Glass passivated chip junction
• Ultrafast reverse recovery time
• Low forward voltage drop
• Low switching losses, high efficiency
• High forward surge capability
• Solder dip 275 °C max. 10 s, per JESD 22-B106
• Material categorization: for defin
Datasheet
2
UF4002

Vishay
Ultrafast Plastic Rectifier

• Glass passivated chip junction
• Ultrafast reverse recovery time
• Low forward voltage drop
• Low switching losses, high efficiency
• High forward surge capability
• Solder dip 275 °C max. 10 s, per JESD 22-B106
• Material categorization: for defin
Datasheet
3
UF4001

Vishay
Ultrafast Plastic Rectifier

• Glass passivated chip junction
• Ultrafast reverse recovery time
• Low forward voltage drop
• Low switching losses, high efficiency
• High forward surge capability
• Solder dip 275 °C max. 10 s, per JESD 22-B106
• Material categorization: for defin
Datasheet
4
UF4003

Vishay
Ultrafast Plastic Rectifier

• Glass passivated chip junction
• Ultrafast reverse recovery time
• Low forward voltage drop
• Low switching losses, high efficiency
• High forward surge capability
• Solder dip 275 °C max. 10 s, per JESD 22-B106
• Material categorization: for defin
Datasheet
5
UF4005

Vishay
Ultrafast Plastic Rectifier

• Glass passivated chip junction
• Ultrafast reverse recovery time
• Low forward voltage drop
• Low switching losses, high efficiency
• High forward surge capability
• Solder dip 275 °C max. 10 s, per JESD 22-B106
• Material categorization: for defin
Datasheet
6
UF4006

Vishay
Ultrafast Plastic Rectifier

• Glass passivated chip junction
• Ultrafast reverse recovery time
• Low forward voltage drop
• Low switching losses, high efficiency
• High forward surge capability
• Solder dip 275 °C max. 10 s, per JESD 22-B106
• Material categorization: for defin
Datasheet
7
UF4007

Vishay
Ultrafast Plastic Rectifier

• Glass passivated chip junction
• Ultrafast reverse recovery time
• Low forward voltage drop
• Low switching losses, high efficiency
• High forward surge capability
• Solder dip 275 °C max. 10 s, per JESD 22-B106
• Material categorization: for defin
Datasheet



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