| No. | Partie # | Fabricant | Description | Fiche Technique |
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Vishay |
Glass Passivated Single-Phase Bridge Rectifier • Ideal for printed circuit boards • High case dielectric strength • High surge current capability e4 • Typical IR less than 0.1 μA • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material categorization: For definitions of compliance please s |
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Vishay |
Ultrafast Soft Recovery Diode • Ultrafast and ultrasoft recovery • Very low IRRM and Qrr • Compliant to RoHS Directive 2002/95/EC • Designed and qualified according to JEDEC-JESD47 • Halogen-free according to IEC 61249-2-21 definition (-N3 only) BENEFITS • Reduced RFI and EMI • R |
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Vishay Siliconix |
Multilayer Ferrite Beads • High reliability. • Surface mountable. • Magnetically self shielded. • Nickel barrier plating virtually eliminates silver migration. MECHANICAL SPECIFICATIONS* Solderability: 90% coverage after 5 second dip in 235°C solder following 60 second pre |
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Vishay Siliconix |
Schottky Barrier Rectifier • Guardring for overvoltage protection • Very small conduction losses • Extremely fast switching • Low forward voltage drop • High frequency operation • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Compliant to RoHS Directive 2002/95/EC and in acc |
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Vishay |
Wirewound Resistors • High temperature silicone coated • Complete welded construction • Qualified to MIL-PRF-39007 • Available in non-inductive styles (type N) with Aryton-Perry winding for lowest reactive components • “S” level failure rate available Note • “Terminal W |
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Vishay |
Wirewound Resistors • High temperature silicone coated • Complete welded construction • Qualified to MIL-PRF-39007 • Available in non-inductive styles (type N) with Aryton-Perry winding for lowest reactive components • “S” level failure rate available Note • “Terminal W |
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Vishay |
Wirewound Resistors • High temperature silicone coated • Complete welded construction • Qualified to MIL-PRF-39007 • Available in non-inductive styles (type N) with Aryton-Perry winding for lowest reactive components • “S” level failure rate available Note • “Terminal W |
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Vishay |
Wirewound Resistors • High temperature silicone coated • Complete welded construction • Qualified to MIL-PRF-39007 • Available in non-inductive styles (type N) with Aryton-Perry winding for lowest reactive components • “S” level failure rate available Note • “Terminal W |
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Vishay |
Wirewound Resistors • High temperature silicone coated • Complete welded construction • Qualified to MIL-PRF-39007 • Available in non-inductive styles (type N) with Aryton-Perry winding for lowest reactive components • “S” level failure rate available Note • “Terminal W |
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Vishay |
Ultrafast Soft Recovery Diode • Ultrafast and ultrasoft recovery • Very low IRRM and Qrr • Designed and qualified JEDEC-JESD47 according to • Material categorization: For definitions of compliance please see www.vishay.com/doc?99912 Cathode to base 2 1 Cathode 3 Anode PR |
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Vishay |
Ultrafast Soft Recovery Diode • Ultrafast and ultrasoft recovery • Very low IRRM and Qrr • Designed and qualified JEDEC-JESD47 according to • Material categorization: For definitions of compliance please see www.vishay.com/doc?99912 Cathode to base 2 1 Cathode 3 Anode PR |
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Vishay |
Ultrafast Soft Recovery Diode • Ultrafast and ultrasoft recovery • Very low IRRM and Qrr • Compliant to RoHS Directive 2002/95/EC • Designed and qualified according to JEDEC-JESD47 • Halogen-free according to IEC 61249-2-21 definition (-N3 only) BENEFITS • Reduced RFI and EMI • R |
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Vishay |
Glass Passivated Single-Phase Bridge Rectifier • Ideal for printed circuit boards • High case dielectric strength • High surge current capability e4 • Typical IR less than 0.1 μA • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material categorization: For definitions of compliance please s |
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Vishay |
Glass Passivated Ultrafast Bridge Rectifier • Ideal for automated placement • High surge current capability • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material categorization: For definitions of compliance please see www.vishay.com/doc?99912 TYPICAL APPLICATIONS General purpose use in |
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Vishay |
Single-Phase Bridge Rectifier • Ideal for printed circuit boards • High case dielectric strength • High surge current capability e4 • Typical IR less than 0.1 μA • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material categorization: For definitions of compliance please |
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Vishay |
Surface Mount Schottky Barrier Rectifier • Low profile package • Ideal for automated placement • Guardring for overvoltage protection • Low power losses, high efficiency • Low forward voltage drop • High surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C • Materi |
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Vishay |
Ultrafast Soft Recovery Diode • Ultrafast and ultrasoft recovery • Very low IRRM and Qrr • Designed and qualified according to JEDEC®-JESD 47 • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 BENEFITS • Reduced RFI and EMI • Reduced pow |
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Vishay |
Small Signal Zener Diodes • Very sharp reverse characteristic • Low reverse current level • Very high stability • Low noise • TZMC - VZ-tolerance ± 5 % • TZMB - VZ-tolerance ± 2 % • AEC-Q101 qualified • Material categorization: For definitions of compliance please see www.vis |
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Vishay |
Transient Voltage Suppressors • Low profile package • Ideal for automated placement • Glass passivated chip junction • Available in uni-directional and bi-directional • 600 W peak pulse power capability with a 10/1000 μs waveform, repetitive rate (duty cycle): 0.01 % Availa |
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Vishay Siliconix |
Surface Mount/ Multilayer Ferrite Beads • High reliability. • Surface mountable. • Magnetically self shielded. • Nickel barrier plating virtually eliminates silver migration. Solderability: 90% coverage after 5 second dip in 235°C solder following 60 second preheat at 120°C to 150°C and t |
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