| No. | Partie # | Fabricant | Description | Fiche Technique |
|---|---|---|---|---|
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Vishay |
Glass Passivated Single-Phase Bridge Rectifier • UL recognition file number E54214 • Ideal for printed circuit board • High surge current capability • High case dielectric strength • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material categorization: For definitions of compliance please see |
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Vishay |
Single Phase Rectifier Bridge • Suitable for printed circuit board mounting • Compact construction • High surge current capability • RoHS compliant RoHS COMPLIANT DESCRIPTION A 2 A single phase encapsulated bridge rectifier consisting of four single diodes connected as a full b |
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Vishay |
Single Phase Rectifier Bridge • Suitable for printed circuit board mounting • Compact construction • High surge current capability • RoHS compliant RoHS COMPLIANT DESCRIPTION A 2 A single phase encapsulated bridge rectifier consisting of four single diodes connected as a full b |
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|
|
|
Vishay |
Glass Passivated Single-Phase Bridge Rectifier • UL recognition file number E54214 • Ideal for printed circuit board • High surge current capability • High case dielectric strength • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material categorization: for definitions of compliance please see |
|
|
|
|
Vishay |
Glass Passivated Single-Phase Bridge Rectifier • UL recognition file number E54214 • Ideal for printed circuit board • High surge current capability • High case dielectric strength • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material categorization: for definitions of compliance please see |
|
|
|
|
Vishay |
Glass Passivated Single-Phase Bridge Rectifier • UL recognition file number E54214 • Ideal for printed circuit board • High surge current capability • High case dielectric strength • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material categorization: for definitions of compliance please see |
|
|
|
|
Vishay |
Glass Passivated Single-Phase Bridge Rectifier • UL recognition file number E54214 • Ideal for printed circuit board • High surge current capability • High case dielectric strength • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material categorization: for definitions of compliance please see |
|
|
|
|
Vishay |
Glass Passivated Single-Phase Bridge Rectifier • UL recognition file number E54214 • Ideal for printed circuit board • High surge current capability • High case dielectric strength • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material categorization: For definitions of compliance please see |
|
|
|
|
Vishay |
Glass Passivated Single-Phase Bridge Rectifier • UL recognition file number E54214 • Ideal for printed circuit board • High surge current capability • High case dielectric strength • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material categorization: For definitions of compliance please see |
|
|
|
|
Vishay |
Glass Passivated Single-Phase Bridge Rectifier • UL recognition file number E54214 • Ideal for printed circuit board • High surge current capability • High case dielectric strength • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material categorization: For definitions of compliance please see |
|
|
|
|
Vishay |
Glass Passivated Single-Phase Bridge Rectifier • UL recognition file number E54214 • Ideal for printed circuit board • High surge current capability • High case dielectric strength • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material categorization: For definitions of compliance please see |
|
|
|
|
Vishay |
Glass Passivated Single-Phase Bridge Rectifier • UL recognition file number E54214 • Ideal for printed circuit board • High surge current capability • High case dielectric strength • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material categorization: For definitions of compliance please see |
|
|
|
|
Vishay |
Glass Passivated Single-Phase Bridge Rectifier • UL recognition file number E54214 • Ideal for printed circuit board • High surge current capability • High case dielectric strength • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material categorization: For definitions of compliance please see |
|
|
|
|
Vishay |
Single Phase Rectifier Bridge • Suitable for printed circuit board mounting • Compact construction • High surge current capability • RoHS compliant RoHS COMPLIANT DESCRIPTION A 2 A single phase encapsulated bridge rectifier consisting of four single diodes connected as a full b |
|
|
|
|
Vishay |
Single Phase Rectifier Bridge • Suitable for printed circuit board mounting • Compact construction • High surge current capability • RoHS compliant RoHS COMPLIANT DESCRIPTION A 2 A single phase encapsulated bridge rectifier consisting of four single diodes connected as a full b |
|
|
|
|
Vishay |
Single Phase Rectifier Bridge • Suitable for printed circuit board mounting • Compact construction • High surge current capability • RoHS compliant RoHS COMPLIANT DESCRIPTION A 2 A single phase encapsulated bridge rectifier consisting of four single diodes connected as a full b |
|
|
|
|
Vishay |
Single Phase Rectifier Bridge • Suitable for printed circuit board mounting • Compact construction • High surge current capability • RoHS compliant RoHS COMPLIANT DESCRIPTION A 2 A single phase encapsulated bridge rectifier consisting of four single diodes connected as a full b |
|
|
|
|
Vishay |
Glass Passivated Single-Phase Bridge Rectifier • UL recognition file number E54214 • Ideal for printed circuit board • High surge current capability • High case dielectric strength • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material categorization: for definitions of compliance please see |
|
|
|
|
Vishay |
Glass Passivated Single-Phase Bridge Rectifier • UL recognition file number E54214 • Ideal for printed circuit board • High surge current capability • High case dielectric strength • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material categorization: for definitions of compliance please see |
|
|
|
|
Vishay |
Glass Passivated Single-Phase Bridge Rectifier • UL recognition file number E54214 • Ideal for printed circuit board • High surge current capability • High case dielectric strength • Solder dip 275 °C max. 10 s, per JESD 22-B106 • Material categorization: for definitions of compliance please see |
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