UPM GMZ fiche technique

No.	Partie #	Fabricant	Description
1	GMZ20	UPM	SURFACE MOUNT ZENER DIODES * Planar Die construction * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes MICRO-MELF .049(1.25) .047(1.2)DIA. Mechanical Data Case: Molded Glass MICRO-MEIF Terminals: Solderable per MIL-STD-202E, Method 208 Polarity: Se
2	GMZ11	UPM	SURFACE MOUNT ZENER DIODES * Planar Die construction * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes MICRO-MELF .049(1.25) .047(1.2)DIA. Mechanical Data Case: Molded Glass MICRO-MEIF Terminals: Solderable per MIL-STD-202E, Method 208 Polarity: Se
3	GMZ4.7	UPM	SURFACE MOUNT ZENER DIODES * Planar Die construction * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes MICRO-MELF .049(1.25) .047(1.2)DIA. Mechanical Data Case: Molded Glass MICRO-MEIF Terminals: Solderable per MIL-STD-202E, Method 208 Polarity: Se
4	GMZ2.4	UPM	SURFACE MOUNT ZENER DIODES * Planar Die construction * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes MICRO-MELF .049(1.25) .047(1.2)DIA. Mechanical Data Case: Molded Glass MICRO-MEIF Terminals: Solderable per MIL-STD-202E, Method 208 Polarity: Se
5	GMZ16	UPM	SURFACE MOUNT ZENER DIODES * Planar Die construction * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes MICRO-MELF .049(1.25) .047(1.2)DIA. Mechanical Data Case: Molded Glass MICRO-MEIF Terminals: Solderable per MIL-STD-202E, Method 208 Polarity: Se
6	GMZ30	UPM	SURFACE MOUNT ZENER DIODES * Planar Die construction * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes MICRO-MELF .049(1.25) .047(1.2)DIA. Mechanical Data Case: Molded Glass MICRO-MEIF Terminals: Solderable per MIL-STD-202E, Method 208 Polarity: Se
7	GMZ22	UPM	SURFACE MOUNT ZENER DIODES * Planar Die construction * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes MICRO-MELF .049(1.25) .047(1.2)DIA. Mechanical Data Case: Molded Glass MICRO-MEIF Terminals: Solderable per MIL-STD-202E, Method 208 Polarity: Se
8	GMZ33	UPM	SURFACE MOUNT ZENER DIODES * Planar Die construction * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes MICRO-MELF .049(1.25) .047(1.2)DIA. Mechanical Data Case: Molded Glass MICRO-MEIF Terminals: Solderable per MIL-STD-202E, Method 208 Polarity: Se
9	GMZ27	UPM	SURFACE MOUNT ZENER DIODES * Planar Die construction * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes MICRO-MELF .049(1.25) .047(1.2)DIA. Mechanical Data Case: Molded Glass MICRO-MEIF Terminals: Solderable per MIL-STD-202E, Method 208 Polarity: Se
10	GMZ56	UPM	SURFACE MOUNT ZENER DIODES * Planar Die construction * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes MICRO-MELF .049(1.25) .047(1.2)DIA. Mechanical Data Case: Molded Glass MICRO-MEIF Terminals: Solderable per MIL-STD-202E, Method 208 Polarity: Se
11	GMZ15	UPM	SURFACE MOUNT ZENER DIODES * Planar Die construction * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes MICRO-MELF .049(1.25) .047(1.2)DIA. Mechanical Data Case: Molded Glass MICRO-MEIF Terminals: Solderable per MIL-STD-202E, Method 208 Polarity: Se
12	GMZ9.1	UPM	SURFACE MOUNT ZENER DIODES * Planar Die construction * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes MICRO-MELF .049(1.25) .047(1.2)DIA. Mechanical Data Case: Molded Glass MICRO-MEIF Terminals: Solderable per MIL-STD-202E, Method 208 Polarity: Se
13	GMZ7.5	UPM	SURFACE MOUNT ZENER DIODES * Planar Die construction * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes MICRO-MELF .049(1.25) .047(1.2)DIA. Mechanical Data Case: Molded Glass MICRO-MEIF Terminals: Solderable per MIL-STD-202E, Method 208 Polarity: Se
14	GMZ5.6	UPM	SURFACE MOUNT ZENER DIODES * Planar Die construction * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes MICRO-MELF .049(1.25) .047(1.2)DIA. Mechanical Data Case: Molded Glass MICRO-MEIF Terminals: Solderable per MIL-STD-202E, Method 208 Polarity: Se
15	GMZ4.3	UPM	SURFACE MOUNT ZENER DIODES * Planar Die construction * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes MICRO-MELF .049(1.25) .047(1.2)DIA. Mechanical Data Case: Molded Glass MICRO-MEIF Terminals: Solderable per MIL-STD-202E, Method 208 Polarity: Se
16	GMZ2.2	UPM	SURFACE MOUNT ZENER DIODES * Planar Die construction * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes MICRO-MELF .049(1.25) .047(1.2)DIA. Mechanical Data Case: Molded Glass MICRO-MEIF Terminals: Solderable per MIL-STD-202E, Method 208 Polarity: Se
17	GMZ2.7	UPM	SURFACE MOUNT ZENER DIODES * Planar Die construction * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes MICRO-MELF .049(1.25) .047(1.2)DIA. Mechanical Data Case: Molded Glass MICRO-MEIF Terminals: Solderable per MIL-STD-202E, Method 208 Polarity: Se
18	GMZ3.9	UPM	SURFACE MOUNT ZENER DIODES * Planar Die construction * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes MICRO-MELF .049(1.25) .047(1.2)DIA. Mechanical Data Case: Molded Glass MICRO-MEIF Terminals: Solderable per MIL-STD-202E, Method 208 Polarity: Se
19	GMZ3.3	UPM	SURFACE MOUNT ZENER DIODES * Planar Die construction * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes MICRO-MELF .049(1.25) .047(1.2)DIA. Mechanical Data Case: Molded Glass MICRO-MEIF Terminals: Solderable per MIL-STD-202E, Method 208 Polarity: Se
20	GMZ18	UPM	SURFACE MOUNT ZENER DIODES * Planar Die construction * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes MICRO-MELF .049(1.25) .047(1.2)DIA. Mechanical Data Case: Molded Glass MICRO-MEIF Terminals: Solderable per MIL-STD-202E, Method 208 Polarity: Se