| No. | Partie # | Fabricant | Description | Fiche Technique |
|---|---|---|---|---|
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Taiwan Semiconductor |
0.2 Watts PNP Transistor ◇ Epitaxial planar die construction ◇ Surface device type mounting ◇ Moisture sensitivity level 1 ◇ Matte Tin(Sn) lead finish with Nickel(Ni) underplate ◇ Pb free version and RoHS compliant ◇ Green compound (Halogen free) with suffix "G" on packing c |
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Taiwan Semiconductor |
NPN Small Signal Transistor ● Low power loss, high efficiency ● Ideal for automated placement ● High surge current capability ● Compliant to RoHS directive 2011/65/EU and in accordance to WEEE 2002/96/EC ● Halogen-free according to IEC 61249-2-21 APPLICATIONS ● Switching mode p |
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Taiwan Semiconductor |
PNP Transistor - Ideally suited for automatic insertion - Epitaxial planar die construction - For switching, AF driver and amplifer applications - Complementary NPN type available (BC817) MECHANICAL DATA - Case: SOT- 23, Molded plastic - Terminal: Solderable per M |
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Taiwan Semiconductor |
NPN Small Signal Transistor ● Low power loss, high efficiency ● Ideal for automated placement ● High surge current capability ● Compliant to RoHS directive 2011/65/EU and in accordance to WEEE 2002/96/EC ● Halogen-free according to IEC 61249-2-21 APPLICATIONS ● Switching mode p |
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Taiwan Semiconductor |
0.2 Watts PNP Transistor ◇ Epitaxial planar die construction ◇ Surface device type mounting ◇ Moisture sensitivity level 1 ◇ Matte Tin(Sn) lead finish with Nickel(Ni) underplate ◇ Pb free version and RoHS compliant ◇ Green compound (Halogen free) with suffix "G" on packing c |
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Taiwan Semiconductor |
PNP Transistor - Epitaxial planar die construction - Surface mount device type - Moisture sensitivity level 1 - Matte Tin(Sn) lead finish with Nickel(Ni) underplate - Pb free and RoHS complian - Green compound (Halogen free) with suffix "G" on packing code and pref |
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Taiwan Semiconductor |
NPN Small Signal Transistor ● Low power loss, high efficiency ● Ideal for automated placement ● High surge current capability ● Compliant to RoHS directive 2011/65/EU and in accordance to WEEE 2002/96/EC ● Halogen-free according to IEC 61249-2-21 APPLICATIONS ● Switching mode p |
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Taiwan Semiconductor |
PNP Small Signal Transistor - Epitaxial planar die construction - Surface mount device type - Moisture sensitivity level 1 - Matte Tin(Sn) lead finish with Nickel(Ni) underplate - Pb free and RoHS complian - Green compound (Halogen free) with suffix "G" on packing code and pref |
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Taiwan Semiconductor |
NPN Transistor - Low reverse current, high reliability - Surface device type mounting - Moisture sensitivity level 1 - Matte Tin(Sn) lead finish with Nickel(Ni) underplate - Pb free version and RoHS compliant - Packing code with suffix "G" means green compound (hal |
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Taiwan Semiconductor |
NPN Transistor - Low reverse current, high reliability - Surface device type mounting - Moisture sensitivity level 1 - Matte Tin(Sn) lead finish with Nickel(Ni) underplate - Pb free version and RoHS compliant - Packing code with suffix "G" means green compound (hal |
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Taiwan Semiconductor |
NPN Transistor - Low reverse current, high reliability - Surface device type mounting - Moisture sensitivity level 1 - Matte Tin(Sn) lead finish with Nickel(Ni) underplate - Pb free version and RoHS compliant - Packing code with suffix "G" means green compound (hal |
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Taiwan Semiconductor |
NPN Transistor - Low reverse current, high reliability - Surface device type mounting - Moisture sensitivity level 1 - Matte Tin(Sn) lead finish with Nickel(Ni) underplate - Pb free version and RoHS compliant - Packing code with suffix "G" means green compound (hal |
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|
|
|
Taiwan Semiconductor |
NPN Small Signal Transistor - Epitaxial planar die construction - Surface mount device type - Moisture sensitivity level 1 - Matte Tin(Sn) lead finish with Nickel(Ni) underplate - Pb free and RoHS complian - Green compound (Halogen free) with suffix "G" on packing code and pref |
|
|
|
|
Taiwan Semiconductor |
NPN Small Signal Transistor - Epitaxial planar die construction - Surface mount device type - Moisture sensitivity level 1 - Matte Tin(Sn) lead finish with Nickel(Ni) underplate - Pb free and RoHS complian - Green compound (Halogen free) with suffix "G" on packing code and pref |
|
|
|
|
Taiwan Semiconductor |
PNP Small Signal Transistor - Epitaxial planar die construction - Surface mount device type - Moisture sensitivity level 1 - Matte Tin(Sn) lead finish with Nickel(Ni) underplate - Pb free and RoHS complian - Green compound (Halogen free) with suffix "G" on packing code and pref |
|
|
|
|
Taiwan Semiconductor |
0.2 Watts PNP Transistor ◇ Epitaxial planar die construction ◇ Surface device type mounting ◇ Moisture sensitivity level 1 ◇ Matte Tin(Sn) lead finish with Nickel(Ni) underplate ◇ Pb free version and RoHS compliant ◇ Green compound (Halogen free) with suffix "G" on packing c |
|
|
|
|
Taiwan Semiconductor |
PNP Small Signal Transistor - Epitaxial planar die construction - Surface mount device type - Moisture sensitivity level 1 - Matte Tin(Sn) lead finish with Nickel(Ni) underplate - Pb free and RoHS complian - Green compound (Halogen free) with suffix "G" on packing code and pref |
|
|
|
|
Taiwan Semiconductor |
PNP Small Signal Transistor - Epitaxial planar die construction - Surface mount device type - Moisture sensitivity level 1 - Matte Tin(Sn) lead finish with Nickel(Ni) underplate - Pb free and RoHS complian - Green compound (Halogen free) with suffix "G" on packing code and pref |
|
|
|
|
Taiwan Semiconductor |
NPN Transistor - Low reverse current, high reliability - Surface device type mounting - Moisture sensitivity level 1 - Matte Tin(Sn) lead finish with Nickel(Ni) underplate - Pb free version and RoHS compliant - Packing code with suffix "G" means green compound (hal |
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Taiwan Semiconductor |
NPN Transistor - Low reverse current, high reliability - Surface device type mounting - Moisture sensitivity level 1 - Matte Tin(Sn) lead finish with Nickel(Ni) underplate - Pb free version and RoHS compliant - Packing code with suffix "G" means green compound (hal |
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