No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
|
|
TRSYS |
GLASS PASSIVATED JUNCTION SILICON ZENER DIODE l l l l l l l l Low profile package Built-in strain relief Glass passivated junction Low inductance Excellent clamping capability Typical ID less than 1 A above 11V High temperature soldering : DO-15 260 /10 seconds at terminals Plastic package has |
|
|
|
TRSYS |
GLASS PASSIVATED JUNCTION SILICON ZENER DIODE l l l l l l l l Low profile package Built-in strain relief Glass passivated junction Low inductance Excellent clamping capability Typical ID less than 1 A above 11V High temperature soldering : DO-15 260 /10 seconds at terminals Plastic package has |
|
|
|
TRSYS |
GLASS PASSIVATED JUNCTION SILICON ZENER DIODE l l l l l l l l Low profile package Built-in strain relief Glass passivated junction Low inductance Excellent clamping capability Typical ID less than 1 A above 11V High temperature soldering : DO-15 260 /10 seconds at terminals Plastic package has |
|
|
|
TRSYS |
GLASS PASSIVATED JUNCTION SILICON ZENER DIODE l l l l l l l l Low profile package Built-in strain relief Glass passivated junction Low inductance Excellent clamping capability Typical ID less than 1 A above 11V High temperature soldering : DO-15 260 /10 seconds at terminals Plastic package has |
|
|
|
TRSYS |
GLASS PASSIVATED JUNCTION SILICON ZENER DIODE l l l l l l l l Low profile package Built-in strain relief Glass passivated junction Low inductance Excellent clamping capability Typical ID less than 1 A above 11V High temperature soldering : DO-15 260 /10 seconds at terminals Plastic package has |
|
|
|
TRSYS |
GLASS PASSIVATED JUNCTION SILICON ZENER DIODE l l l l l l l l Low profile package Built-in strain relief Glass passivated junction Low inductance Excellent clamping capability Typical ID less than 1 A above 11V High temperature soldering : DO-15 260 /10 seconds at terminals Plastic package has |
|
|
|
TRSYS |
GLASS PASSIVATED JUNCTION SILICON ZENER DIODE l l l l l l l l Low profile package Built-in strain relief Glass passivated junction Low inductance Excellent clamping capability Typical ID less than 1 A above 11V High temperature soldering : DO-15 260 /10 seconds at terminals Plastic package has |
|
|
|
TRSYS |
GLASS PASSIVATED JUNCTION SILICON ZENER DIODE l l l l l l l l Low profile package Built-in strain relief Glass passivated junction Low inductance Excellent clamping capability Typical ID less than 1 A above 11V High temperature soldering : DO-15 260 /10 seconds at terminals Plastic package has |
|
|
|
TRSYS |
GLASS PASSIVATED JUNCTION SILICON ZENER DIODE l l l l l l l l Low profile package Built-in strain relief Glass passivated junction Low inductance Excellent clamping capability Typical ID less than 1 A above 11V High temperature soldering : DO-15 260 /10 seconds at terminals Plastic package has |
|
|
|
TRSYS |
GLASS PASSIVATED JUNCTION SILICON ZENER DIODE l l l l l l l l Low profile package Built-in strain relief Glass passivated junction Low inductance Excellent clamping capability Typical ID less than 1 A above 11V High temperature soldering : DO-15 260 /10 seconds at terminals Plastic package has |
|
|
|
TRSYS |
GLASS PASSIVATED JUNCTION SILICON ZENER DIODE l l l l l l l l Low profile package Built-in strain relief Glass passivated junction Low inductance Excellent clamping capability Typical ID less than 1 A above 11V High temperature soldering : DO-15 260 /10 seconds at terminals Plastic package has |
|
|
|
TRSYS |
GLASS PASSIVATED JUNCTION SILICON ZENER DIODE l l l l l l l l Low profile package Built-in strain relief Glass passivated junction Low inductance Excellent clamping capability Typical ID less than 1 A above 11V High temperature soldering : DO-15 260 /10 seconds at terminals Plastic package has |
|
|
|
TRSYS |
GLASS PASSIVATED JUNCTION SILICON ZENER DIODE l l l l l l l l Low profile package Built-in strain relief Glass passivated junction Low inductance Excellent clamping capability Typical ID less than 1 A above 11V High temperature soldering : DO-15 260 /10 seconds at terminals Plastic package has |
|
|
|
TRSYS |
GLASS PASSIVATED JUNCTION SILICON ZENER DIODE l l l l l l l l Low profile package Built-in strain relief Glass passivated junction Low inductance Excellent clamping capability Typical ID less than 1 A above 11V High temperature soldering : DO-15 260 /10 seconds at terminals Plastic package has |
|
|
|
TRSYS |
GLASS PASSIVATED JUNCTION SILICON ZENER DIODE l l l l l l l l Low profile package Built-in strain relief Glass passivated junction Low inductance Excellent clamping capability Typical ID less than 1 A above 11V High temperature soldering : DO-15 260 /10 seconds at terminals Plastic package has |
|
|
|
TRSYS |
GLASS PASSIVATED JUNCTION SILICON ZENER DIODE l l l l l l l l Low profile package Built-in strain relief Glass passivated junction Low inductance Excellent clamping capability Typical ID less than 1 A above 11V High temperature soldering : DO-15 260 /10 seconds at terminals Plastic package has |
|
|
|
TRSYS |
GLASS PASSIVATED JUNCTION SILICON ZENER DIODE l l l l l l l l Low profile package Built-in strain relief Glass passivated junction Low inductance Excellent clamping capability Typical ID less than 1 A above 11V High temperature soldering : DO-15 260 /10 seconds at terminals Plastic package has |
|
|
|
TRSYS |
GLASS PASSIVATED JUNCTION SILICON ZENER DIODE l l l l l l l l Low profile package Built-in strain relief Glass passivated junction Low inductance Excellent clamping capability Typical ID less than 1 A above 11V High temperature soldering : DO-15 260 /10 seconds at terminals Plastic package has |
|
|
|
TRSYS |
GLASS PASSIVATED JUNCTION SILICON ZENER DIODE l l l l l l l l Low profile package Built-in strain relief Glass passivated junction Low inductance Excellent clamping capability Typical ID less than 1 A above 11V High temperature soldering : DO-15 260 /10 seconds at terminals Plastic package has |
|
|
|
TRSYS |
GLASS PASSIVATED JUNCTION SILICON ZENER DIODE l l l l l l l l Low profile package Built-in strain relief Glass passivated junction Low inductance Excellent clamping capability Typical ID less than 1 A above 11V High temperature soldering : DO-15 260 /10 seconds at terminals Plastic package has |
|