No. | Partie # | Fabricant | Description | Fiche Technique |
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TEMIC Semiconductors |
Van Controller Serial Interface TSS463 / TSS461C Van Controllers Serial Interface (TSS463) Wafer process: Available plastic package types: Locations: Process, product development Wafer plant QC responsability Assembly Z86E SOIC16 (TSS463), SOIC24 (TSS461C) TEMIC Semiconductors |
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TEMIC Semiconductors |
Van Controller Serial Interface TSS463 / TSS461C Van Controllers Serial Interface (TSS463) Wafer process: Available plastic package types: Locations: Process, product development Wafer plant QC responsability Assembly Z86E SOIC16 (TSS463), SOIC24 (TSS461C) TEMIC Semiconductors |
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TEMIC Semiconductors |
Van Controller Serial Interface TSS463 / TSS461C Van Controllers Serial Interface (TSS463) Wafer process: Available plastic package types: Locations: Process, product development Wafer plant QC responsability Assembly Z86E SOIC16 (TSS463), SOIC24 (TSS461C) TEMIC Semiconductors |
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TEMIC Semiconductors |
Van Controller Serial Interface TSS463 / TSS461C Van Controllers Serial Interface (TSS463) Wafer process: Available plastic package types: Locations: Process, product development Wafer plant QC responsability Assembly Z86E SOIC16 (TSS463), SOIC24 (TSS461C) TEMIC Semiconductors |
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TEMIC Semiconductors |
Van Controller Serial Interface TSS463 / TSS461C Van Controllers Serial Interface (TSS463) Wafer process: Available plastic package types: Locations: Process, product development Wafer plant QC responsability Assembly Z86E SOIC16 (TSS463), SOIC24 (TSS461C) TEMIC Semiconductors |
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TEMIC Semiconductors |
GaAs/GaAlAs Infrared Emitting Diode D High radiant power and high radiant intensity D Suitable for high pulse current operation D Low forward voltage D Angle of half intensity ϕ = ± 22° D Peak wavelength l p = 925 nm D High reliability 94 8491 Applications High power infrared emitter |
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