TDK FK1 fiche technique

No.	Partie #	Fabricant	Description
1	FK18X7R1H102K	TDK	Capacitor • High capacitance has been achieved through improvements in the thinning process of ceramic dielectric layers and multi-layer lamination technology. • High reliability is maintained under specified environmental conditions. • Low residual inductance
2	FK11X5R0J686M	TDK	Capacitor • High capacitance has been achieved through improvements in the thinning process of ceramic dielectric layers and multi-layer lamination technology. • High reliability is maintained under specified environmental conditions. • Low residual inductance
3	FK11X5R1A226M	TDK	Capacitor • High capacitance has been achieved through improvements in the thinning process of ceramic dielectric layers and multi-layer lamination technology. • High reliability is maintained under specified environmental conditions. • Low residual inductance
4	FK14C0G1H822J	TDK	Capacitor • High capacitance has been achieved through improvements in the thinning process of ceramic dielectric layers and multi-layer lamination technology. • High reliability is maintained under specified environmental conditions. • Low residual inductance
5	FK11X5R0J226M	TDK	Capacitor • High capacitance has been achieved through improvements in the thinning process of ceramic dielectric layers and multi-layer lamination technology. • High reliability is maintained under specified environmental conditions. • Low residual inductance
6	FK11X5R0J336M	TDK	Capacitor • High capacitance has been achieved through improvements in the thinning process of ceramic dielectric layers and multi-layer lamination technology. • High reliability is maintained under specified environmental conditions. • Low residual inductance
7	FK11X5R1C226M	TDK	Capacitor • High capacitance has been achieved through improvements in the thinning process of ceramic dielectric layers and multi-layer lamination technology. • High reliability is maintained under specified environmental conditions. • Low residual inductance
8	FK11X5R1C106K	TDK	Capacitor • High capacitance has been achieved through improvements in the thinning process of ceramic dielectric layers and multi-layer lamination technology. • High reliability is maintained under specified environmental conditions. • Low residual inductance
9	FK11X5R1E106K	TDK	Capacitor • High capacitance has been achieved through improvements in the thinning process of ceramic dielectric layers and multi-layer lamination technology. • High reliability is maintained under specified environmental conditions. • Low residual inductance
10	FK11X5R1E475K	TDK	Capacitor • High capacitance has been achieved through improvements in the thinning process of ceramic dielectric layers and multi-layer lamination technology. • High reliability is maintained under specified environmental conditions. • Low residual inductance
11	FK11X5R1H335K	TDK	Capacitor • High capacitance has been achieved through improvements in the thinning process of ceramic dielectric layers and multi-layer lamination technology. • High reliability is maintained under specified environmental conditions. • Low residual inductance
12	FK16X7R1E155K	TDK	Capacitor • High capacitance has been achieved through improvements in the thinning process of ceramic dielectric layers and multi-layer lamination technology. • High reliability is maintained under specified environmental conditions. • Low residual inductance
13	FK16X7R1C335K	TDK	Capacitor • High capacitance has been achieved through improvements in the thinning process of ceramic dielectric layers and multi-layer lamination technology. • High reliability is maintained under specified environmental conditions. • Low residual inductance
14	FK16X7R1E684K	TDK	Capacitor • High capacitance has been achieved through improvements in the thinning process of ceramic dielectric layers and multi-layer lamination technology. • High reliability is maintained under specified environmental conditions. • Low residual inductance
15	FK16X7R1E105K	TDK	Capacitor • High capacitance has been achieved through improvements in the thinning process of ceramic dielectric layers and multi-layer lamination technology. • High reliability is maintained under specified environmental conditions. • Low residual inductance
16	FK16X7R1H105K	TDK	Capacitor • High capacitance has been achieved through improvements in the thinning process of ceramic dielectric layers and multi-layer lamination technology. • High reliability is maintained under specified environmental conditions. • Low residual inductance
17	FK16X7R1C106K	TDK	Capacitor • High capacitance has been achieved through improvements in the thinning process of ceramic dielectric layers and multi-layer lamination technology. • High reliability is maintained under specified environmental conditions. • Low residual inductance
18	FK16X7R1H155K	TDK	Capacitor • High capacitance has been achieved through improvements in the thinning process of ceramic dielectric layers and multi-layer lamination technology. • High reliability is maintained under specified environmental conditions. • Low residual inductance
19	FK14X7R1E225K	TDK	Capacitor • High capacitance has been achieved through improvements in the thinning process of ceramic dielectric layers and multi-layer lamination technology. • High reliability is maintained under specified environmental conditions. • Low residual inductance
20	FK14X7R1E684K	TDK	Capacitor • High capacitance has been achieved through improvements in the thinning process of ceramic dielectric layers and multi-layer lamination technology. • High reliability is maintained under specified environmental conditions. • Low residual inductance