Skyworks Solutions CLA fiche technique

No.	Partie #	Fabricant	Description
1	CLA4609-000	Skyworks Solutions	Silicon Limiter Diode Bondable Chips • Established Skyworks limiter diode process • High-power, mid-range, and cleanup designs • Low insertion loss: 0.1 dB @ 2.6 GHz • Peak power handling to +74 dBm • Ultra-low spike leakage power • Tight control of I layer base width • Mesa and planar
2	CLA4610-085LF	Skyworks Solutions	Surface Mount Limiter Diode  Low thermal resistance: 73 °C/W  Typical threshold level: +16 dBm @ 2.6 GHz  Low capacitance: 0.32 pF  Low-profile, ultra-miniature QFN (3-pin, 2 x 2 mm) package (MSL1, 260 C per JEDEC J-STD-020) Skyworks Green™ products are compliant with all
3	CLA4602-000	Skyworks Solutions	Silicon Limiter Diode Bondable Chips • Established Skyworks limiter diode process • High-power, mid-range, and cleanup designs • Low insertion loss: 0.1 dB @ 2.6 GHz • Peak power handling to +74 dBm • Ultra-low spike leakage power • Tight control of I layer base width • Mesa and planar
4	CLA4603-085LF	Skyworks Solutions	Surface Mount Limiter Diode
5	CLA4611-085LF	Skyworks Solutions	Surface Mount Limiter Diode  Low thermal resistance: 15 °C/W  Typical threshold level: +25 dBm  Low capacitance: 0.25 pF  Low profile, ultra-miniature QFN (3-pin, 2 x 2 mm) package (MSL1, 260 C per JEDEC J-STD-020) Skyworks GreenTM products are compliant with all applicabl
6	CLA4601-000	Skyworks Solutions	Silicon Limiter Diode Bondable Chips • Established Skyworks limiter diode process • High-power, mid-range, and cleanup designs • Low insertion loss: 0.1 dB @ 2.6 GHz • Peak power handling to +74 dBm • Ultra-low spike leakage power • Tight control of I layer base width • Mesa and planar
7	CLA4603-000	Skyworks Solutions	Silicon Limiter Diode Bondable Chips • Established Skyworks limiter diode process • High-power, mid-range, and cleanup designs • Low insertion loss: 0.1 dB @ 2.6 GHz • Peak power handling to +74 dBm • Ultra-low spike leakage power • Tight control of I layer base width • Mesa and planar
8	CLA4604-000	Skyworks Solutions	Silicon Limiter Diode Bondable Chips • Established Skyworks limiter diode process • High-power, mid-range, and cleanup designs • Low insertion loss: 0.1 dB @ 2.6 GHz • Peak power handling to +74 dBm • Ultra-low spike leakage power • Tight control of I layer base width • Mesa and planar
9	CLA4605-000	Skyworks Solutions	Silicon Limiter Diode Bondable Chips • Established Skyworks limiter diode process • High-power, mid-range, and cleanup designs • Low insertion loss: 0.1 dB @ 2.6 GHz • Peak power handling to +74 dBm • Ultra-low spike leakage power • Tight control of I layer base width • Mesa and planar
10	CLA4606-000	Skyworks Solutions	Silicon Limiter Diode Bondable Chips • Established Skyworks limiter diode process • High-power, mid-range, and cleanup designs • Low insertion loss: 0.1 dB @ 2.6 GHz • Peak power handling to +74 dBm • Ultra-low spike leakage power • Tight control of I layer base width • Mesa and planar
11	CLA4607-000	Skyworks Solutions	Silicon Limiter Diode Bondable Chips • Established Skyworks limiter diode process • High-power, mid-range, and cleanup designs • Low insertion loss: 0.1 dB @ 2.6 GHz • Peak power handling to +74 dBm • Ultra-low spike leakage power • Tight control of I layer base width • Mesa and planar
12	CLA4608-000	Skyworks Solutions	Silicon Limiter Diode Bondable Chips • Established Skyworks limiter diode process • High-power, mid-range, and cleanup designs • Low insertion loss: 0.1 dB @ 2.6 GHz • Peak power handling to +74 dBm • Ultra-low spike leakage power • Tight control of I layer base width • Mesa and planar
13	CLA4610-000	Skyworks Solutions	Silicon Limiter Diode Bondable Chips • Established Skyworks limiter diode process • High-power, mid-range, and cleanup designs • Low insertion loss: 0.1 dB @ 2.6 GHz • Peak power handling to +74 dBm • Ultra-low spike leakage power • Tight control of I layer base width • Mesa and planar
14	CLA4611-000	Skyworks Solutions	Silicon Limiter Diode Bondable Chips • Established Skyworks limiter diode process • High-power, mid-range, and cleanup designs • Low insertion loss: 0.1 dB @ 2.6 GHz • Peak power handling to +74 dBm • Ultra-low spike leakage power • Tight control of I layer base width • Mesa and planar