| No. | Partie # | Fabricant | Description | Fiche Technique |
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Siemens Semiconductor |
Multi SIDELED Bright Green Die q q q q q q color of package: white for use as optical indicator for backlighting, optical coupling into light pipes and lenses suitable for all SMT assembly and soldering methods available taped on reel (8 mm tape) load dump resistant acc. to DIN 4 |
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Siemens |
Bright Green Die q P-LCC-4 package q color of package: white q for use as optical indicator q for backlighting, optical coupling into light pipes and lenses q suitable for all SMT assembly and soldering methods q available taped on reel (8 mm tape) q load dump resist |
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Siemens Semiconductor |
3 mm (T1) MULTILED / Non Diffused colorless clear plastic package antiparallel chips high signal efficiency possible by color change of the LED with appropriate controlling by IC (e.g. SDA2231) it is possible to change color from green to yellow, orange and super-red q both colors ca |
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Siemens Semiconductor |
3 mm (T1) MULTILED / Diffused colorless, diffused package antiparallel chips high signal effiency possible by color change of the LED with appropriate controlling by IC (e.g. SDA 2231) it is possible to change color from green to yellow, orange and super-red q both colors can be |
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Siemens Semiconductor |
Multi SIDELED Bright Green Die q q q q q q color of package: white for use as optical indicator for backlighting, optical coupling into light pipes and lenses suitable for all SMT assembly and soldering methods available taped on reel (8 mm tape) load dump resistant acc. to DIN 4 |
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Siemens Semiconductor |
Multi SIDELED Bright Green Die q q q q q q color of package: white for use as optical indicator for backlighting, optical coupling into light pipes and lenses suitable for all SMT assembly and soldering methods available taped on reel (8 mm tape) load dump resistant acc. to DIN 4 |
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Siemens Semiconductor |
Multi TOPLEDRG P-LCC-4 package color of package: white for use as optical indicator for backlighting, optical coupling into light pipes and lenses both chips can be controlled separately high signal efficiency possible by color change of the LED with appropriate co |
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Siemens Semiconductor |
Multi TOPLEDRG P-LCC-4 package color of package: white for use as optical indicator for backlighting, optical coupling into light pipes and lenses both chips can be controlled separately high signal efficiency possible by color change of the LED with appropriate co |
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Siemens |
High-Current LED q P-LCC-4 package q color of package: white q for use as optical indicator q appropriate for high ambient light because of the higher operation current (≤ 50 mA DC) q for backlighting, optical coupling into light pipes and lenses q both chips can be |
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Siemens Semiconductor |
3 mm (T1) MULTILED / Non Diffused colorless clear plastic package antiparallel chips high signal efficiency possible by color change of the LED with appropriate controlling by IC (e.g. SDA2231) it is possible to change color from green to yellow, orange and super-red q both colors ca |
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Siemens Semiconductor |
3 mm (T1) MULTILED / Diffused colorless, diffused package antiparallel chips high signal effiency possible by color change of the LED with appropriate controlling by IC (e.g. SDA 2231) it is possible to change color from green to yellow, orange and super-red q both colors can be |
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Siemens Semiconductor |
Multi SIDELED Bright Green Die q q q q q q color of package: white for use as optical indicator for backlighting, optical coupling into light pipes and lenses suitable for all SMT assembly and soldering methods available taped on reel (8 mm tape) load dump resistant acc. to DIN 4 |
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Siemens Semiconductor |
Multi SIDELED Bright Green Die q q q q q q color of package: white for use as optical indicator for backlighting, optical coupling into light pipes and lenses suitable for all SMT assembly and soldering methods available taped on reel (8 mm tape) load dump resistant acc. to DIN 4 |
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Siemens Semiconductor |
Multi ARGUS LED 3 mm T1 LED / Non Diffused q q q q q q q q q q q farbloses, klares Gehäuse Kunststoffgehäuse mit spezieller Formgebung antiparallel geschaltete Leuchtdiodenchips hohe Signalwirkung durch Farbwechsel der LED möglich bei Einsatz eines äußeren Reflektors zur Hintergrundbeleuchtu |
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Siemens Semiconductor |
Super Multi ARGUS LED High-Current / 3 mm T1 LED / Non Diffused q q q q q q q q q q q colorless, clear package plastic package with a special design antiparallel chip appropriate for high ambient light because of the higher operating current (typ. 50 mA) high signal efficiency possible by color change of the LED |
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Siemens Semiconductor |
Multi TOPLED P-LCC-4 package color of package: white for use as optical indicator for backlighting, optical coupling into light pipes and lenses both chips can be controlled separately high signal efficiency possible by color change of the LED with appropriate co |
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Siemens Semiconductor |
Multi TOPLED Cathodes On One Side P-LCC-4 package color of package: white for use as optical indicator for backlighting, optical coupling into light pipes and lenses both chips can be controlled separately high signal efficiency possible by color change of the LED with appropriate co |
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Siemens Semiconductor |
Multi TOPLEDRG P-LCC-4 package color of package: white for use as optical indicator for backlighting, optical coupling into light pipes and lenses both chips can be controlled separately high signal efficiency possible by color change of the LED with appropriate co |
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Siemens Semiconductor |
Multi TOPLEDRG P-LCC-4 package color of package: white for use as optical indicator for backlighting, optical coupling into light pipes and lenses both chips can be controlled separately high signal efficiency possible by color change of the LED with appropriate co |
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Siemens Semiconductor |
Multi TOPLEDRG P-LCC-4 package color of package: white for use as optical indicator for backlighting, optical coupling into light pipes and lenses both chips can be controlled separately high signal efficiency possible by color change of the LED with appropriate co |
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