No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
|
|
Sanyo Semicon Device |
CMOS LSI VTR(B/VHS) SERVO CIRCUIT |
|
|
|
Sanyo Semicon Device |
Thick Film Hybrid Integrated Circuit 100W MIN AF POWER AMP |
|
|
|
Sanyo Semicon Device |
Thick Film Hybrid Integrated Circuit 50W min AF Power Amp Output Stage With Built-in Emitter Resistance |
|
|
|
Sanyo Semicon Device |
Push-Pull Circuit Applications · Composite type with a PNP transistor and an NPN transistor contained in one package, facilitating highdensity mounting. · Each device incorporated in the FP207 is equivalent to the 2A1729 and to the 2SC4520, respectively. Package Dimensions unit:m |
|
|
|
Sanyo Semicon Device |
INTEGRATED EMITTER RESISTOR THICK FILM FILM HYBRID INTEGRATED CIRCUIT |
|
|
|
Sanyo Semicon Device |
THICK FILM HYBRID INTEGRATED CIRCUIT |
|
|
|
Sanyo Semicon Device |
Dual PLL Frequency Synthesizer Circuit |
|
|
|
Sanyo Semicon Device |
Dual PLL Frequency Synthesizer Circuit |
|
|
|
Sanyo Semicon Device |
Push-Pull Circuit Applications · Composite type with 2 transistors (PNP and NPN) contained in one package facilitating high-density mounting. · The FP202 is formed with a chip being equivalent to the 2SA1338 and a chip being equivalent to the 2SC3392, placed in one package. Packa |
|
|
|
Sanyo Semicon Device |
Push-Pull Circuit Applications · Composite type with a PNP transistor and an NPN transistor in one package, facilitating high-density mounting. · The FP204 is composed of 2 chips, one being equivalent to the 2SB1123 and 2SD1623, which are placed in one package. Electrical Connecti |
|
|
|
Sanyo Semicon Device |
HYBRID INTERGRATED CIRCUITS/WITH FBET/LSBT PROCESSS CHIPS/WIDE BANDWIDTH VIDEO OUTPUT ICS |
|
|
|
Sanyo Semicon Device |
Push-Pull Circuit Applications · Composite type with a PNP transistor and an NPN transistor in one package, facilitating high-density mounting. · The FP205 is composed of 2 chips, one being equivalent to the 2SA1416 and the other 2SC3646, which are placed in one package. Electrica |
|
|
|
Sanyo Semicon Device |
Push-Pull Circuit Applications · Composite type with a PNP transistor and an NPN transistor in one package, facilitating high-density mounting. · The FP206 is composed of 2 chips, one being equivalent to the 2SA1728 and the other 2SC4519, placed in one package. Electrical Connecti |
|
|
|
Sanyo Semicon Device |
HYBRID INTERGRATED CIRCUITS/WITH FBET/LSBT PROCESSS CHIPS/WIDE BANDWIDTH VIDEO OUTPUT ICS |
|
|
|
Sanyo Semicon Device |
HYBRID INTERGRATED CIRCUITS/WITH FBET/LSBT PROCESSS CHIPS/WIDE BANDWIDTH VIDEO OUTPUT ICS • High output voltage and wide bandwidth make the VPS10 optimal for use in f H (horizontal deflection frequency) = 85 kHz class color monitors. (f = 100 MHz –3 dB at VOUT = 50 Vp-p) • SIP molded 15-pin package with three channels in a single package. |
|
|
|
Sanyo Semicon Device |
Cell Type RC-2400 |
|
|
|
Sanyo Semicon Device |
Thick Film Hybrid Integrated Circuit BRIDGE POWER PACK |
|
|
|
Sanyo Semicon Device |
VIF / SIF Signal-Processing Circuit • Automatic adjustment VCO (no external VCO coil is required). • Built-in audio carrier trap supports the B/G, I, D/K, and M/N audio systems. • Digital AFT adopted. Package Dimensions unit : mm 3157B 71504 JO IM No.7960-1/2 http://www.Datasheet4U. |
|
|
|
Sanyo Semicon Device |
Mobile FM Multiplex Broadcast DARC Receiver nd VICS data • Applications can use either a parallel CPU interface (DMA) or a CCB serial interface. • Supply voltage: 4.5 to 5.5 V (LC72710W), 2.7 to 3.6 V (LC72710LW) Package Dimensions unit: mm 3190-SQFP64 [LC72710W, 72710LW] 12.0 10.0 1.25 48 49 |
|
|
|
Sanyo Semicon Device |
Mobile FM Multiplex Broadcast DARC Receiver multiplex frame structures (methods A, A', B, and C) under CPU control. • MSK delay detection system based on a 1T delay. • Error correction function based on a 2T delay (in the MSK detection stage) • Digital PLL based clock regeneration function • S |
|